Patents Assigned to HITACHI KASEI POLYMER CO., LTD.
  • Publication number: 20110021695
    Abstract: A urethane (meth)acrylate composition includes a product of a reaction of a polyester polyol made from a polycarboxylic acid and a polyhydric alcohol, a polyisocyanate, and an active hydrogen-containing (meth)acrylate. Part of the polyhydric alcohol is a diol having a straight chain of 3 to 7 carbon atoms and a side chain on the straight chain. The polyisocyanate includes at least one of hexamethylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, and tetramethylene diisocyanate.
    Type: Application
    Filed: September 29, 2010
    Publication date: January 27, 2011
    Applicants: HITACHI KASEI POLYMER CO., LTD., NHK SPRING CO., LTD.
    Inventors: Kouichi Akiyama, Norihiro Fukuta, Masanori Sukenobu, Souichirou Komiya, Hiroyuki Fujita, Kenji Horie, Takako Oyama, Noriyuki Sera, Hisayoshi Makabe
  • Publication number: 20100040889
    Abstract: The method of manufacturing shoes of the present invention comprises a pre-step of heating a following reactive hot-melt adhesive to melt it and providing the melted adhesive on a joining surface of at least one adherend, an ultraviolet treating step of irradiating the adhesive with ultraviolet light having irradiation energy more than 100 mJ/cm2 and less than 1200 mJ/cm2 to polymerize a polyurethane prepolymer, and a joining step of overlaying a joining surface of another adherend on the adhesive to bond both adherends together. The reactive hot-melt adhesive contains a polyurethane prepolymer having an (meth)acryloyl group and an isocyanate group at the end of a molecule, and a photopolymerization initiator. The polyurethane prepolymer includes a non-crystalline polyol and a crystalline polyol, wherein the non-crystalline polyol is contained from 20% by mass to 90% by mass with respect to the whole polyols. The viscosity of the reactive hot-melt adhesive at 80° C. is 300 Pa·s or less.
    Type: Application
    Filed: January 29, 2008
    Publication date: February 18, 2010
    Applicants: ASICS CORPORATION, HITACHI KASEI POLYMER CO., LTD.
    Inventors: Kenichi Harano, Tatsuya Amano, Hisao Matsumiya