Patents Assigned to Hitachi, Litd.
  • Diode laser module and application equipment
    Patent number: 6782018
    Abstract: This invention is provided to reduce wavefront aberrations caused by the filling of a transparent resin intended to prevent degradation of a diode laser in a hermetically sealed package. A parallel-plane plate is arranged between a diode laser and an objective lens, and a transparent resin is filled into a space formed between the diode laser and the parallel-plane plate. With this invention, degradations of the diode lasers can be prevented and the wavefront aberrations can be reduced.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: August 24, 2004
    Assignee: Hitachi, Litd.
    Inventors: Kimio Tatsuno, Masahide Tokuda, Shigeharu Kimura, Takeshi Shimano, Hirohisa Sano