Patents Assigned to Hitachi, Ltd. & Hitachi Cable, Ltd.
  • Heat transfer surface with multiple layers
    Patent number: 4602681
    Abstract: In a heat transfer wall provided with a plurality of cells and restricted holes, the cells are formed in a plurality of laminated layers in a direction from an outer surface of the heat transfer wall to an inside thereof, and the cells of the upper and lower layers and the outside of the outer surface are communicated to one another through the holes.
    Type: Grant
    Filed: October 26, 1983
    Date of Patent: July 29, 1986
    Assignee: Hitachi, Ltd. & Hitachi Cable, Ltd.
    Inventors: Takahiro Daikoku, Wataru Nakayama, Tadakatsu Nakajima, Heikichi Kuwahara, Hiromichi Yoshida