Abstract: A method for the production of a printed wiring board according to this invention includes applying a preflux represented by the following general formula (1): ##STR1## (wherein R.sub.1 stands of H or an alkyl group of one to 17 carbon atoms, R.sub.2 for H or an alkyl group of one to six carbon atoms, and n for an integer in the range between 0 and 3) or the following general formula (2): ##STR2## (wherein R.sub.3 stands for H or an alkyl group of one to six carbon atoms, R.sub.4 for H or an alkyl group of one to six carbon atoms, R.sub.5 for an alkyl group of zero to seven carbon atoms, and n for an integer in the range between 0 and 3) to a printed wiring board on which circuits have been formed and then performing an oxidizing treatment on the printed wiring board.

Abstract: A printed wiring board comprising a preflux film of a benzimidazole copper complex, wherein the benzimidazole copper complex is formed by (i) applying a preflux to the printed wiring board and (ii) performing an oxidizing treatment of the preflux coated wiring board sufficient to form a benzimidazole copper complex wherein said complex is substantially free of free imidazole groups from the benzimidazole preflux.