Abstract: In the photo electro device, a laser diode chip is set fixedly through a submount to a heatsink in a package. In assembling, first a ball lens is anchored to a holder of a lens support frame by clinching claws of the holder. Subsequently the surfaces of the ball lens on the obverse and reverse sides of the lens support frame are coated with nonreflective films. Then the position of the lens support frame is adjusted relatively to the laser diode chip so that the respective optical axes are aligned with each other. And after an arm is welded fixedly to the heatsink, a frame member is severed or removed to complete the work for setting the ball lens.

Abstract: The present invention resides in a hybrid integrated circuit device comprising; a plurality of electronic parts; a wiring board mounting the plurality of electronic parts on the primary front surface thereof; and a plurality of leads secured to the edge of the wiring board, the device being featured in that a fixing section of each of the leads consists of a main fixing portion secured to the primary rear surface of the wiring board, and an auxiliary fixing portion secured to the side face of the wiring board, the auxiliary fixing portion of the lead being branched from the main fixing portion thereof such that the branched auxiliary fixing portion is bent at an angle of approximately 90.degree. with respect to the main fixing portion. This provides the hybrid integrated circuit device in which the leads have the enhanced connection strength against the wiring board, and the wiring board has a lower mounted height.

Abstract: An optoelectronics device wherein a light-receiving element which defines a monitor light receiver and a semiconductor laser which generates a laser beam are hermetically sealed in the same package, and wherein the light-receiving surface of the element for measuring the output power of the beam of light emitted from the semiconductor laser is disposed so as to be inclined with respect to the light-emitting surface of the semiconductor laser. The wire bonding surface of the light-receiving element pellet-bonded to a stem and the wire bonding surface of the lead electrically connected to the light-receiving element through a wire are arranged so as to be parallel with each other. Thus, it is possible to support both the bonding surfaces horizontally at the same time. As a result, a bonding tool can be brought into perpendicular contact with each of the bonding surfaces, and this enables appropriate wire bonding to be effected.