Patents Assigned to Hitachi Via Mechanics, Ltd.
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Publication number: 20100288742Abstract: A consumable electrode type arc welding method for generating arc between a plate-shaped work and a welding wire by a mixed shield gas including argon gas to weld the plate-shaped work, includes: making a state of reverse polarity in which the polarity of the welding wire is positive at the welding start time, and switching at least once to a state of positive polarity in which the polarity of the welding wire is negative.Type: ApplicationFiled: May 14, 2010Publication date: November 18, 2010Applicants: KABUSHIKI KAISHA YASKAWA DENKI, HITACHI VIA MECHANICS, LTD.Inventors: Seigo Nishikawa, Kanji Katada, Hirotaka Adachi, Tsuneo Shinada, Hideyasu Machii
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Patent number: 7820089Abstract: A method for forming an array of three dimensional electrode elements for micro-batteries, including forming a plurality of first parallel channels in a substrate, filling the plurality of first channels with a sacrificial filler material, forming at least one plurality of second parallel channels, each of the pluralities of channels being oriented in a different direction, and removing the sacrificial filler material to leave a grid array of electrode elements. The method may further include a preliminary step of depositing a sacrificial coating onto the surface of the substrate and a final step of removing the sacrificial coating and any debris resulting from the channel forming steps deposited thereon.Type: GrantFiled: January 9, 2009Date of Patent: October 26, 2010Assignee: Hitachi Via Mechanics, Ltd.Inventor: Todd E. Lizotte
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Patent number: 7777898Abstract: A laser machining apparatus is capable of improving workpiece machining precision. The laser machining apparatus has a movable table for supporting a workpiece to be machined, and a camera for detecting the position of the workpiece by reflection light from an alignment mark formed through the workpiece. The apparatus also includes a jig plate provided between the table and the workpiece, and has light-receiving holes that overlap with the alignment mark (through-hole) and that are larger than the alignment mark (through hole).Type: GrantFiled: February 20, 2008Date of Patent: August 17, 2010Assignee: Hitachi Via Mechanics, Ltd.Inventors: Kaoru Matsumura, Fumiaki Kimura
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Patent number: 7768225Abstract: A difference between each position command data outputted in a form of a step signal from a high-level controller and its corresponding detected position data of a movable body is integrated by an integral compensator to position the movable body. Assuming, for example, that the movable body is a steerable mirror, digital filters are arranged to compensate the value of an initial state of an angular displacement and the value of an initial state of an angular velocity, respectively, and respective impulse responses of the digital filters as additional input elements are added to an output terminal of the integral compensator. For higher effectiveness, internal state variables of the digital filters can desirably be cleared to zero whenever an angle (position) command data is received.Type: GrantFiled: February 4, 2005Date of Patent: August 3, 2010Assignee: Hitachi Via Mechanics Ltd.Inventors: Souichi Toyama, Yaichi Okubo, Hiromu Hirai, Makoto Iwasaki, Motohiro Kawafuku, Noriaki Hirose
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Patent number: 7760328Abstract: The mask-less exposure apparatus includes: a stage which moves with the substrate having a photosensitive resin layer with sensitivity to ultraviolet radiation formed thereon; a first light source for emitting light containing a wavelength component in the wavelength range of 300 to 410 nm; a first light irradiation optical system for modulating a radiant flux emitted from the first light source based on data of a desired exposure pattern to image a pattern on the photosensitive resin layer; a second light source for emitting light containing a wavelength component in the wavelength range of 450 to 2500 nm; and a second light irradiation optical system for guiding a radiant flux emitted from the second light source to a second light irradiation area that is set so as to include at least a first light irradiation area.Type: GrantFiled: March 8, 2006Date of Patent: July 20, 2010Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yoshihide Yamaguchi, Hiroshi Oyama
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Patent number: 7755741Abstract: An illumination apparatus and an exposure apparatus that achieves higher quality exposure to light and higher operating speed even where the ratio Hx/Hy between the transverse dimension Hx and the longitudinal dimension Hy of the plane of optical modulation of a two-dimensional optical space modulator is 1.5 or above, for instance, are to be provided. The focal distance fx in an x-direction and the focal distance fy in a y-direction of a second optical system that guides light emitted from an integrator to a two-dimensional optical space modulator are made different, in a ratio of fx/fy=1.6, for instance. In this way, the number of rod lenses in the integrator can be made equal between transverse and longitudinal directions and the value of Hx/Hy can be made 2.5 by bringing the aspect ratio dx:dy of rod lenses to 1.6:1, close to 1.Type: GrantFiled: August 16, 2007Date of Patent: July 13, 2010Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yoshitada Oshida, Kazuo Kobayashi
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Patent number: 7718920Abstract: There is provided a method and a device capable of holding a sheet-like workpiece without wrinkles. The sheet-like workpiece holding method includes mounting the sheet-like workpiece such that almost no tensile force is applied thereon on a machining table, and pressing out wrinkles of the sheet-like workpiece by lowering a pressing member whose surface facing to the workpiece protrudes in the shape of a convex lens toward the workpiece so that the workpiece is pressed against the machining table. The method also includes retaining the sheet-like workpiece on the machining table using suction while continuously pressing the sheet-like workpiece with the pressing member and releasing the pressing force of the pressing member while retaining the sheet-like workpiece.Type: GrantFiled: November 3, 2005Date of Patent: May 18, 2010Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yasushi Ito, Fumiaki Kimura
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Patent number: 7666320Abstract: There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.Type: GrantFiled: May 31, 2006Date of Patent: February 23, 2010Assignee: Hitachi Via Mechanics, Ltd.Inventors: Toshinori Kawamura, Haruo Akahoshi, Kunio Arai
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Patent number: 7668364Abstract: Inspection of partially drilled microvias by fluorescence based optical imaging techniques, selective coaxial illumination and multivariable off-axis illumination and the use of comparative image analysis and the transformation of back reflected radiation by means of an integrated fluorescing plate mounted to the surface of a CCD or EMCCD array.Type: GrantFiled: April 26, 2006Date of Patent: February 23, 2010Assignee: Hitachi Via Mechanics, Ltd.Inventors: Todd E. Lizotte, Orest Ohar
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Publication number: 20100027570Abstract: Fiber lasers and methods for constructing and using fiber lasers for micro-/nano-machining with output beams including stacked pulses and combinations of continuous wave, pseudo-continuous wave and pulse sequence components.Type: ApplicationFiled: July 27, 2009Publication date: February 4, 2010Applicant: HITACHI VIA MECHANICS, LTD.Inventors: Todd E. LIZOTTE, Orest OHAR
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Patent number: 7637702Abstract: There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per a certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.Type: GrantFiled: July 20, 2006Date of Patent: December 29, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Takao Furukawa, Hiroshi Kawasaki, Toshiyuki Iwata, Katsuhiro Nagasawa, Takahiko Yamashita
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Patent number: 7629714Abstract: A rocking actuator and a laser machining apparatus which can suppress a temperature rise of a permanent magnet in a moving-magnet actuator. Even when a steerable mirror is positioned by rapid and continuous motions, highly reliable machining can be performed without degrading machining throughput or hole position accuracy. A cooling jacket for cooling a casing and heat transfer units brought into contact with a coil and the casing are provided. Heat generated in the coil is introduced to the casing through the heat transfer bypass units. Thus, the temperature rise of the coil is suppressed. Radial grooves are provided in the permanent magnet opposed to the coil so as to prevent an eddy current from appearing therein. Groove depth is made not smaller than skin depth expressed by a function of volume resistivity and permeability of the permanent magnet and a fundamental frequency of a current applied to the coil.Type: GrantFiled: August 3, 2007Date of Patent: December 8, 2009Assignees: Hitachi Via Mechanics, Ltd., National University Corporation Nagoya Institute of TechnologyInventors: Souichi Toyama, Kounosuke Kitamura, Akira Doi, Hiromu Hirai, Kenta Seki, Yoshiaki Kano
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Patent number: 7612479Abstract: A scanner has a rotor, and a stator disposed in the outside of the rotor. The rotor includes a shaft, and a permanent magnet mounted on the outer circumferential side of the shaft. The stator includes a casing, a yoke held in the inner circumferential side of the casing, and coils disposed in the inner circumferential side of the yoke. The permanent magnet of the rotor has radially depressed grooves formed in its outer circumferential portion. The torque constant of the scanner is circumferentially equalized by the grooves.Type: GrantFiled: June 23, 2006Date of Patent: November 3, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Akira Doi, Haruaki Otsuki, Atsushi Sakamoto, Souichi Toyama, Yaichi Okubo
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Patent number: 7602822Abstract: Fiber lasers and methods for constructing and using fiber lasers for micro-/nano-machining with output beams including stacked pulses and combinations of continuous wave, pseudo-continuous wave and pulse sequence components.Type: GrantFiled: September 28, 2005Date of Patent: October 13, 2009Assignee: Hitachi Via Mechanics, LtdInventors: Todd E Lizotte, Orest Ohar
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Publication number: 20090179354Abstract: A method for forming an array of three dimensional electrode elements for micro-batteries, including forming a plurality of first parallel channels in a substrate, filling the plurality of first channels with a sacrificial filler material, forming at least one plurality of second parallel channels, each of the pluralities of channels being oriented in a different direction, and removing the sacrificial filler material to leave a grid array of electrode elements. The method may further include a preliminary step of depositing a sacrificial coating onto the surface of the substrate and a final step of removing the sacrificial coating and any debris resulting from the channel forming steps deposited thereon.Type: ApplicationFiled: January 9, 2009Publication date: July 16, 2009Applicant: HITACHI VIA MECHANICS, LTD.Inventor: Todd E. LIZOTTE
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Publication number: 20090166340Abstract: A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained.Type: ApplicationFiled: March 3, 2009Publication date: July 2, 2009Applicant: Hitachi Via Mechanics, Ltd.Inventors: Kunio Arai, Hiroyuki Sugawara, Hiroaki Ashizawa, Hiromi Nishiyawa
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Patent number: 7548323Abstract: A laser beam system for measuring an aspect of a surface wherein a laser beam is reshaped into a corrected shaped laser beam having a corrected energy profile and subsequently reshaped into a measurement shaped laser beam having an measurement energy profile shaped to be effected by the at least one aspect of the surface. The measurement shaped laser beam is reflected from the surface, being modified by the aspect of interest of the surface, and to a sensor array wherein the sensors measure the reflected laser beam to determine the aspect of interest of the surface.Type: GrantFiled: November 22, 2005Date of Patent: June 16, 2009Assignee: Hitachi Via Mechanics, LtdInventor: Todd E. Lizotte
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Patent number: 7531767Abstract: A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained.Type: GrantFiled: March 2, 2006Date of Patent: May 12, 2009Assignee: Hitachi Via Mechanics, Ltd.Inventors: Kunio Arai, Hiroyuki Sugawara, Hiroaki Ashizawa, Hiromi Nishiyawa
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Publication number: 20090111062Abstract: The present invention provides a pattern formation method comprising a step of forming on a substrate a film of a first photosensitive material having low sensitivity to a light beam with a main wavelength at h-line emitted from a mask-less drawing exposure apparatus but having high sensitivity to an energy light beam containing ultraviolet light; a step of forming on the first photosensitive material a film of a second photosensitive material having higher sensitivity to a light beam with the main wavelength at h-line; a step of drawing a second pattern on the second photosensitive material with the mask-less direct drawing exposure apparatus; a step of developing the second photosensitive material; and a step of exposing to a light beam the second photosensitive material with the second pattern formed thereon and the first photosensitive material in batch to form a target first pattern on the first photosensitive material.Type: ApplicationFiled: October 29, 2008Publication date: April 30, 2009Applicant: Hitachi Via Mechanics, Ltd.Inventors: Masako Kato, Yoshihide Yamaguchi, Takehiko Hasebe, Masakazu Kishi, Tsuyoshi Yamaguchi
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Patent number: 7522262Abstract: A method for determining a position of a reference point in which there is no influence of aberration of a camera lens or the like, but an error caused by a failure in shape of an alignment mark can be reduced. An alignment mark consisting of a plurality of pattern portions (and background portions) centering at a design reference point is provided in advance. Positions of centers of border lines of the patterns are calculated. Obtained coordinate values of the centers are averaged in each axial direction. The averaged coordinate values are regarded as coordinate values of a machining reference point. Thus, even when a defect occurs in any pattern portion, an error caused by the defect is reduced so that the accuracy in machining can be improved.Type: GrantFiled: June 1, 2005Date of Patent: April 21, 2009Assignee: Hitachi Via Mechanics Ltd.Inventors: Hiroyuki Sugawara, Takeshi Goto, Kounosuke Kitamura, Hiroshi Aoyama