Patents Assigned to Hitachi Via Mechanics
  • Patent number: 6909735
    Abstract: A laser process system with multiple, independently steerable laser beamlets and including a laser and beam shaper for generating a shaped source beam, a splitter stage for generating a plurality of beamlets from the shaped source beam, a beamlet controller including an independently steerable beamlet steering mirror for and corresponding to each beamlet for independently directing the corresponding beamlet, a mirror controller for controlling each beamlet steering mirror, and an optical path including a scanning lens for directing each steered beamlet to a target area of a workpiece. Each beamlet steering mirror is a multi-axis micro-electro-mechanical mirror and the system further includes a beam dump located in the optical path for intercepting a beamlet steered into the beam dump by the corresponding beamlet steering mirror.
    Type: Grant
    Filed: April 10, 2003
    Date of Patent: June 21, 2005
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Todd E. Lizotte, Orest Ohar
  • Publication number: 20050127051
    Abstract: A laser machining apparatus in which three or more beam splits are made incident on one machining lens so that high speed machining can be achieved, and the machining quality (shapes, dimensions, accuracy and straightness of machined holes) is excellent. The optical paths of beams A and B having the same polarization direction are aligned almost in one and the same direction by a total reflection/transmission type beam combining means 31c using a difference in incident angle. After that, the optical paths of the beams A and B and the optical path of a beam C different in polarization direction therefrom are aligned almost in one and the same direction by a polarizing type beam combining means 32. Then, the beams A, B and C are made incident on a machining lens 45.
    Type: Application
    Filed: March 10, 2004
    Publication date: June 16, 2005
    Applicant: Hitachi Via Mechanics Ltd.
    Inventors: Sadao Mori, Hiroyuki Sugawara, Hiroshi Aoyama
  • Publication number: 20050128553
    Abstract: A scanner system includes a servo control unit. A rotation angle of a rotating shaft supporting a mirror is detected, and an error of the detected value with respect to a commanded value is integrated by an integral compensator so that the detected value is able to track the commanded value. A tracking error proportional compensator is disposed in parallel with the integral compensator so as to add a correction value proportional to the error to the integrated value of the error. A plurality of gains are prepared for each of the integral compensator, the tracking error proportional compensator, a detected value proportional compensator and a detected value differential compensator of the servo control unit. Each gain is changed in accordance with a travel angle of the commanded value. Thus, the mirror can be positioned quickly so that the machining speed can be improved.
    Type: Application
    Filed: August 27, 2004
    Publication date: June 16, 2005
    Applicant: Hitachi Via Mechanics Ltd.
    Inventors: Souichi Toyama, Haruaki Otsuki, Atsushi Sakamoto, Kenta Seki, Yaichi Okubo
  • Publication number: 20050098549
    Abstract: The present invention relates to a laser beam machining apparatus which enables plural sheets of work to be mounted so as to be simultaneously processed, and which has a small size, even in the case where the number of sheets of work is increased.
    Type: Application
    Filed: December 20, 2004
    Publication date: May 12, 2005
    Applicant: Hitachi Via Mechanics, Ltd.
    Inventors: Yasushi Ito, Futao Naruse, Fumihiro Ueno
  • Patent number: 6884962
    Abstract: An improved beam for use in ablating a surface to be processed. The improved beam front has a profile with a plurality of undulation and the plurality of undulations define a plurality of annular peaks and annular valleys. An intensity of each annular peak is about 10 percent greater than an intensity of each annular valley whereby the undulation of the improved beam facilitates formation of a substantially uniform feature in the surface to be processed. A method of utilizing an improved beam to form the desired feature in a surface to be processed is also disclosed. To reduce energy losses, a fourier transform is performed on the supplied laser beam. Before striking the surface, this beam passes through a focusing lens which performs a reverse fourier transform and retransforms the wave front substantially back to its originally wave form and intensity.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: April 26, 2005
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventor: Todd E. Lizotte
  • Patent number: 6853489
    Abstract: A laser correction element for the correction of angular deviation due to pointing instability and radial displacement due to thermal drift, including one or more of an angular deviation non-symmetric optical element for redirecting a beam axis of a laser beam through a first corrective angle dependent upon the angle of incidence of the laser beam on the angular deviation element to be parallel with an optimum centerline and a radial displacement non-symmetric optical element for redirecting a beam axis of a laser beam through a second corrective angle dependent upon a radial displacement of the beam axis. A collimating non-symmetric optical element may redirect the laser beam through a third corrective angle dependent on radial displacement of the beam axis from a centerline and angle of incidence on the collimating element.
    Type: Grant
    Filed: April 10, 2003
    Date of Patent: February 8, 2005
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventor: Todd E. Lizotte
  • Patent number: 6849824
    Abstract: Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an f? lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the f? lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: February 1, 2005
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Kunio Arai, Kenji Suzuki
  • Publication number: 20040217093
    Abstract: There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.
    Type: Application
    Filed: May 27, 2004
    Publication date: November 4, 2004
    Applicant: Hitachi Via Mechanics, Ltd.
    Inventors: Kunio Arai, Kazuhisa Ishii
  • Publication number: 20040212862
    Abstract: An optical scanner which can realize target trajectory tracking machining at a high speed and with a high accuracy. In a servo control circuit controlling the operation of an X-axis scanner for positioning a mirror and the operation of a Y-axis scanner for positioning another mirror, sine wave response is performed at a specific frequency on feedback control for each axis so that the gain characteristic and the phase characteristic of the feedback control are estimated. This arithmetic operation processing is performed by a microprocessor prior to machining, and the results of estimation of the two axes are stored as data for each frequency. In the stage of machining, the results of estimation in terms of the gain characteristic and the phase characteristic are used for correcting the amplitude and phase of a sine wave of a target trajectory in order to cancel each characteristic.
    Type: Application
    Filed: January 16, 2004
    Publication date: October 28, 2004
    Applicant: Hitachi Via Mechanics, Ltd.
    Inventors: Souichi Toyama, Atsushi Sakamoto, Haruaki Otsuki, Yaichi Okubo
  • Patent number: 6804269
    Abstract: A laser beam delivery system for supplying a laser beam to a computer generated hologram which shapes and divides the supplied laser beam into a plurality of pseudo flat top laser beams. The plurality of pseudo flat top laser beams are then passed through collimated optics which alter the beams so that the beams are conveyed along the optical axis in a parallel manner. The plurality of collimated laser beams then passes through a converging mechanism which facilitates converging of the plurality of separated collimated laser beams through a clear aperture of a mirror of a first repeat positioning device so that all of the light is received by the repeat positioning device and appropriately reflected thereby to a second mirror of a second repeat positioning device and then to a rear surface of an F-Theta lens. The F-Theta lens focuses the plurality of separated collimated laser beams at the object to be processed.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: October 12, 2004
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Todd E. Lizotte, Orest Ohar
  • Publication number: 20040173590
    Abstract: A multi-axis laser machine in which the working efficiency can be improved even when machining positions in respective systems are different from each other. The positioning operation of a laser positioning unit for positioning an optical path of a laser beam in an axis and the positioning operation of another laser positioning unit for positioning another optical path of the laser beam in another axis are performed independently of each other. An arbitration unit monitors the laser positioning units as to whether they have finished positioning or not. The arbitration unit operates a deflection unit (AOM) so as to supply the laser beam to one of the laser positioning units which has finished positioning. Incidentally, when the laser positioning units finish positioning simultaneously, the arbitration unit supplies the laser beam to the laser positioning units in a predetermined sequence.
    Type: Application
    Filed: December 16, 2003
    Publication date: September 9, 2004
    Applicant: Hitachi Via Mechanics Ltd.
    Inventors: Izumi Hata, Toshiya Nishimura, Hidenori Tateishi, Yasuyuki Shimizu, Tetsuo Murakami
  • Publication number: 20040128816
    Abstract: The invention provides a machining method and a machining apparatus in which the machining productivity and the machining quality of the machining apparatus can be improved. Prior to machining, an NC control unit makes an X-axis drive unit move a table based on examination conditions specified in advance. Thus, the NC control unit obtains a stabilization time required from the command-reach time of a poisoning command and till the stabilization of position response of the table within a predetermined allowable range. Likewise, for means for moving a drill in a Y-axis direction, the NC control unit obtains a stabilization time required till the stabilization of position response within a predetermined allowable range. At the time of machining, the drill is moved in a Z-axis direction to cut into a printed wiring board as soon as the obtained stabilization time has passed.
    Type: Application
    Filed: October 7, 2003
    Publication date: July 8, 2004
    Applicant: Hitachi Via Mechanics Ltd.
    Inventors: Kazuo Watanabe, Takahiko Yamashita, Yasushi Ito, Katsuhiro Nagasawa
  • Patent number: 6703603
    Abstract: A controller for an optical scanner includes a mirror angle detecting unit for detecting an angle of a mirror, a rotation shaft angle detecting unit for detecting an angle of the shaft, a current detecting unit for detecting a current supplied to a motor, and a torsional vibration stabilizing compensation unit for stabilizing a torsional vibration of the shaft, thereby a value subjected to a proportional compensation and a differential compensation by using a rotation shaft angle detected value and a value from the torsional vibration stabilizing compensation unit are negatively fed back to a value obtained by integrally compensating for a tracking error between the angle desired value and a mirror angle detection value to determine a current value to be supplied to the motor.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: March 9, 2004
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Souichi Tohyama, Hiromu Hirai, Kichio Nakajima, Atsushi Sakamoto, Yaichi Okubo, Masahiro Oishi
  • Patent number: 6694627
    Abstract: A printed circuit board processing machine has: a table that can travel in a X-direction carrying a printed circuit board thereon; a cross rail arranged so as to straddle the table; a plurality of sliders supported for independently movement in a Y-direction by the cross rail; a plurality of spindles supported for movement in a Z-direction by the sliders; a magnetic rail of a linear-motor fixed to the cross rail; and a plurality of coils of the linear-motor fixed to the sliders so as to oppose the magnetic rail.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: February 24, 2004
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Yasushi Ito, Akira Irie
  • Patent number: 6627850
    Abstract: The welding method according to the present invention is adapted to carry out a welding operation by feeding a welding wire to a material to be welded, and generating an arc between the material to be welded and welding wire, in which the welding is done with the welding wire feeding speed increased and reduced during the welding operation, the welding wire feeding speed being reduced after the occurrence of short-circuiting is detected, the welding wire feeding speed being increased after the cancellation of the short-circuiting and the transfer of the welding operation to the formation of the arc are detected.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: September 30, 2003
    Assignees: Kabushiki Kaisha Yaskawa Denki, Hitachi Via Mechanics, Ltd.
    Inventors: Yasuhiro Koga, Shinji Okumura, Takahide Hirayama, Satoru Nio, Haruki Nakashima, Tsuneo Mita
  • Patent number: 6623219
    Abstract: Nuts 22, 23 are engaged with one ball screw 10, and the nut 22 is directly fixed on a slider main body 7s. The nut 23 is rotatably held by a bearing 25, and a bearing holder 24 holding the bearing 25 is fixed on a slider main body 7t. And, a gear 26 is fixed on the side of the nut 23, and a gear 29 engaging with the gear 26 is provided. And, a motor 28 for driving a gear 29 is fixed on a bracket 27, being united with the slider main body 7t. The ball screw 10 is stopped and the motor 28 is rotated so as to individually position the slider 7b. Even if the number of the sliders is increased, a machine is not made bigger, and the printed board processing machine having simple structure can be provided.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: September 23, 2003
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Katsuhiro Nagasawa, Tamio Otani, Akira Irie
  • Publication number: 20030102427
    Abstract: A controller for an optical scanner includes a mirror angle detecting unit for detecting an angle of a mirror, a rotation shaft angle detecting unit for detecting an angle of the shaft, a current detecting unit for detecting a current supplied to a motor, and a torsional vibration stabilizing compensation unit for stabilizing a torsional vibration of the shaft, thereby a value subjected to a proportional compensation and a differential compensation by using a rotation shaft angle detected value and a value from the torsional vibration stabilizing compensation unit are negatively fed back to a value obtained by integrally compensating for a tracking error between the angle desired value and a mirror angle detection value to determine a current value to be supplied to the motor.
    Type: Application
    Filed: November 30, 2001
    Publication date: June 5, 2003
    Applicant: Hitachi Via Mechanics, Ltd.
    Inventors: Souichi Tohyama, Hiromu Hirai, Kichio Nakajima, Atsushi Sakamoto, Yaichi Okubo, Masahiro Oishi
  • Patent number: 6531677
    Abstract: An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: March 11, 2003
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Kunio Arai, Kazuhisa Ishii, Yasuhiko Kita
  • Patent number: 6521866
    Abstract: Beam distributing/shaping units 21a and 21b the number of which is the same as the number of heads 7a and 7b are disposed in series with each other on an optical path of a laser beam 2 radiated from a laser oscillator 1. Then, the beam distributing/shaping units 21a and 21b are operated so that a laser pulse is supplied to one of the heads which has been positioned. By selecting the timing for operating the beam distributing/shaping units 21a and 21b, the laser beam 2 having energy the magnitude of which is substantially fixed is supplied to a portion to be machined. Thus, the laser oscillator is used effectively, and the machining energy is controlled accurately so that a high-quality hole can be machined.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: February 18, 2003
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Kunio Arai, Humio Watanabe
  • Patent number: 6479788
    Abstract: The invention provides a method and an apparatus of making a hole in a printed circuit board, which improve the quality of a hole shape and the processing speed. In accordance with the invention, a control apparatus controls a laser oscillator and a galvano mirrors so as to form a hole while gradually reducing a pulse width in each step with respect to one hole. As a result of this, no insulating material is left on the bottom portion of the hole, and it is possible to make a hole having an intended shape, particularly, having a desired diameter of the hole bottom.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: November 12, 2002
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Kunio Arai, Hiroshi Aoyama, Hideo Ueno