Patents Assigned to Hitco Technologies Inc.
  • Patent number: 5683281
    Abstract: A Czochralski process furnace component comprises a high purity, semiconductor standard composite including a carbon fiber reinforced carbon matrix having a level of metal impurity below the detection limit of inductively coupled plasma spectroscopy. A process for producing the components includes heat treatment of the carbon fiber and the components.
    Type: Grant
    Filed: February 27, 1995
    Date of Patent: November 4, 1997
    Assignee: Hitco Technologies, Inc
    Inventor: Robert Howard Metter
  • Patent number: 5612399
    Abstract: A processable blend having high temperature and thermal shock resistance properties includes a resin blend which includes at least one first silicone polymer and at least one second silicone polymer. The processable blend is ceramitizable at a temperature above about 1100.degree. F. A method of producing an article with high temperature and thermal shock resistance properties includes forming a silicone blend of at least one first silicone polymer and at least one second silicone polymer, wherein the blend is ceramitizable at a temperature above about 1100.degree. F.; forming the blend into the shape of the desired article; and, at least partially curing at least one of said silicone polymers at a temperature below the ceramitization temperature.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: March 18, 1997
    Assignee: Hitco Technologies, Inc.
    Inventors: Don A. Beckley, John Stites
  • Patent number: 5552466
    Abstract: A processable blend having high temperature and thermal shock resistance properties includes a resin blend which includes at least one first silicone polymer and at least one second silicone polymer. The processable blend is ceramitizable at a temperature above about 1100.degree. F. A method of producing an article with high temperature and thermal shock resistance properties includes forming a silicone blend of at least one first silicone polymer and at least one second silicone polymer, wherein the blend is ceramitizable at a temperature above about 1100.degree. F.; forming the blend into the shape of the desired article; and, at least partially curing at least one of said silicone polymers at a temperature below the ceramitization temperature.
    Type: Grant
    Filed: December 15, 1994
    Date of Patent: September 3, 1996
    Assignee: Hitco Technologies Inc.
    Inventors: Don A. Beckley, John Stites