Patents Assigned to Hitron Technologies
  • Modular housing structure for modem
    Patent number: 6967846
    Abstract: A modular housing structure having: a top casing; a bottom casing, assembled with the top casing, wherein at least a first circuit board is interposed between the top casing and the bottom casing; and a thickening set interposed between the top casing and the bottom casing and assembled with the top casing and the bottom casing via a plurality of fixing elements so as to accommodate other members such that an electronic device having the housing structure meets at least two specifications.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: November 22, 2005
    Assignee: Hitron Technologies
    Inventor: H. L. Chen
  • Modular housing structure for modem
    Publication number: 20040125571
    Abstract: A modular housing structure, comprising: a top casing; a bottom casing, assembled with the top casing, wherein at least a first circuit board is interposed between the top casing and the bottom casing; and a thickening set interposed between the top casing and the bottom casing and assembled with the top casing and the bottom casing via a plurality of fixing elements so as to accommodate other members such that an electronic device having the housing structure meets at least two specifications.
    Type: Application
    Filed: April 7, 2003
    Publication date: July 1, 2004
    Applicant: Hitron Technologies
    Inventor: H. L. Chen