Abstract: A filtered feedthrough assembly (100, 100', 100", 200, 200", 300) for use in implantable medical devices is provided. The filtered feedthrough assembly provides at least one chip capacitor (110, 210) or an LC circuit coupled between a lead wire (12) and an end surface (18) of a metallic ferrule (14). The chip capacitor is secured in position by means of a [non-conductive film (122) and] conductive material (120) applied to opposing ends of the chip capacitor. The end portion of the feedthrough and chip capacitor may be encapsulated by an encapsulant (102) to provide a moisture resistant coating therefor.
Type:
Grant
Filed:
November 9, 1995
Date of Patent:
July 22, 1997
Assignee:
Hittman Materials & Medical Components, Inc.
Inventors:
Fred Hittman, Allan S. Gelb, Marcia J. Gelb, Thomas N. Foreman