Patents Assigned to Hiwin Mikrosystems Corp.
  • Patent number: 10211692
    Abstract: The present invention provides a permanent magnet motor, in which three holes, including a middle hole and side holes located on two sides of the middle hole, are disposed in a magnetic island of a rotor, the middle hole and the side holes satisfying specific conditions respectively, thereby achieving an optimal cogging reduction efficacy.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: February 19, 2019
    Assignee: HIWIN MIKROSYSTEMS CORP.
    Inventors: Jhen Nan Kuo, Li-Wei Zheng, Ming Hung Hsieh
  • Patent number: 9968002
    Abstract: The present invention provides a heat-transfer mechanism of a motor primary, wherein a heat-transfer member having a metallic body is sandwiched between a motor moving member and a bearing member, such that the heat-transfer member separates the bearing member from the motor moving member to prevent direct contact there-between while the heat-transfer member is used as a heat-conducting medium, and therefore, heat energy on the bearing member and the motor moving member can be gathered in the heat-transfer member, and the effect of effectively dissipating, by means of conduction, the heat energy from the motor moving member and from the bearing member driven by the motor can be achieved.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 8, 2018
    Assignee: HIWIN MIKROSYSTEMS CORP.
    Inventors: Hsiang-Ju Wang, Chien-Chih Lin, Chao-Chin Teng, Cheng-Te Chi
  • Patent number: 7682113
    Abstract: An extendable gantry comprises a base and an extendable transverse bridge mounted on the base. The extendable transverse bridge has an axial length greater than a width of the base.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: March 23, 2010
    Assignee: Hiwin Mikrosystems Corp.
    Inventors: Pzung-Cheng Liou, Don-Hua Cheng
  • Patent number: 7268710
    Abstract: A logic device for the transformation of the output of the RDC into series A-B pulses according to the present invention comprises: a chip with its two minimal bits (LSB-LSB-1) simulating as the clock source of A-B pulses, a signal-processing pin (BUSY) which output a TTL pulse wave as a control signal resource while LSB shifts from a low level to a high level and contrariwise, and a logic processing circuit as well as a buffer to output the displacement and velocity of a rotor in the form of A-B serial pulses.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: September 11, 2007
    Assignee: Hiwin Mikrosystems Corp.
    Inventors: Ming-Hsing Liu, Ming-Yuan Lee
  • Patent number: D589991
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: April 7, 2009
    Assignee: Hiwin Mikrosystems Corp.
    Inventor: Chien-Chih Chen