Patents Assigned to HK CO., LTD.
  • Patent number: 11179804
    Abstract: A laser machining nozzle includes: a nozzle body coupled to a machining head; and a flow path formed through the nozzle body in a longitudinal axis of the nozzle body to allow a machining-assist gas to be injected toward a workpiece therethrough while a laser beam is emitted toward the workpiece, wherein the flow path comprises a first flow path formed in a flow direction of the machining-assist gas and generating a supersonic flow of the machining-assist gas; a second flow path connected to the first flow path in the flow direction of the machining-assist gas and expanding a volume of the machining-assist gas having passed through the first flow path; and a flow path boundary defining a boundary between the first flow path and the second flow path.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: November 23, 2021
    Assignee: HK CO., LTD.
    Inventors: Won Jae Lee, Hak Jae Lee, Sung Jun Jo, Yang Jae Shin
  • Publication number: 20210138583
    Abstract: A laser machining nozzle includes: a nozzle body coupled to a machining head; and a flow path formed through the nozzle body in a longitudinal axis of the nozzle body to allow a machining-assist gas to be injected toward a workpiece therethrough while a laser beam is emitted toward the workpiece, wherein the flow path comprises a first flow path formed in a flow direction of the machining-assist gas and generating a supersonic flow of the machining-assist gas; a second flow path connected to the first flow path in the flow direction of the machining-assist gas and expanding a volume of the machining-assist gas having passed through the first flow path; and a flow path boundary defining a boundary between the first flow path and the second flow path.
    Type: Application
    Filed: February 20, 2017
    Publication date: May 13, 2021
    Applicant: HK CO., LTD.
    Inventors: Won Jae LEE, Hak Jae LEE, Sung Jun JO, Yang Jae SHIN
  • Publication number: 20200269350
    Abstract: Disclosed is a nozzle unit for laser processing, which can implement one-touch coupling and separation, thereby enabling easy nozzle replacement and uniform maintenance of a nozzle in a mounted state at an accurate position while preventing damage to a nozzle joint. The nozzle unit for laser processing includes: a nozzle body including a nozzle hole and a coupling protrusion formed at an outer periphery of the nozzle hole; and a nozzle adapter allowing the nozzle body to be inserted into and coupled to a lower portion thereof and including a nozzle coupling portion allowing the coupling protrusion at a first position to be inserted thereinto or separated therefrom and allowing the coupling protrusion at a second position to be seated thereon, the second position being spaced apart from the first position in a circumferential direction of the nozzle hole.
    Type: Application
    Filed: October 29, 2019
    Publication date: August 27, 2020
    Applicant: HK CO., LTD.
    Inventors: Hyo Sang KIM, Hyun Woo YANG, Won Jae LEE
  • Patent number: D920399
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: May 25, 2021
    Assignee: HK CO., LTD.
    Inventors: Jung Hun Shin, Man Sik Park
  • Patent number: D921071
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: June 1, 2021
    Assignee: HK Co., Ltd.
    Inventors: Man Sik Park, Jung Hun Shin
  • Patent number: D1115880
    Type: Grant
    Filed: June 3, 2024
    Date of Patent: March 3, 2026
    Assignee: HK CO., LTD.
    Inventors: Seok Jin Kang, Do Young Kim, Jang Su Yeo, Yang Jae Shin