Patents Assigned to HK CO., LTD.
  • Publication number: 20260168099
    Abstract: The present invention relates to a nozzle installation structure of a laser processing machine that can prevent contaminants such as spatters generated from the laser processing area from flowing into the head through the purge gas discharge gap under the processing head while effectively cooling the nozzle being processed. According to the nozzle installation structure of the laser processing machine of this invention, the purge gas discharged from the purge gas discharge gap at the bottom of the cover body is guided through the purge gas guider and discharged intensively close to the nozzle effectively cooling the nozzle. Meanwhile, most of the contaminants such as spatters generated from the laser processing portion and scattered at high speed are blocked by the spatter blocking plate minimizing the inflow of contaminants such as spatter into the head.
    Type: Application
    Filed: June 23, 2023
    Publication date: June 18, 2026
    Applicant: HK CO., LTD.
    Inventors: Su Bin CHOI, Man Sik PARK, Yang Jae SHIN
  • Patent number: 11179804
    Abstract: A laser machining nozzle includes: a nozzle body coupled to a machining head; and a flow path formed through the nozzle body in a longitudinal axis of the nozzle body to allow a machining-assist gas to be injected toward a workpiece therethrough while a laser beam is emitted toward the workpiece, wherein the flow path comprises a first flow path formed in a flow direction of the machining-assist gas and generating a supersonic flow of the machining-assist gas; a second flow path connected to the first flow path in the flow direction of the machining-assist gas and expanding a volume of the machining-assist gas having passed through the first flow path; and a flow path boundary defining a boundary between the first flow path and the second flow path.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: November 23, 2021
    Assignee: HK CO., LTD.
    Inventors: Won Jae Lee, Hak Jae Lee, Sung Jun Jo, Yang Jae Shin
  • Publication number: 20210138583
    Abstract: A laser machining nozzle includes: a nozzle body coupled to a machining head; and a flow path formed through the nozzle body in a longitudinal axis of the nozzle body to allow a machining-assist gas to be injected toward a workpiece therethrough while a laser beam is emitted toward the workpiece, wherein the flow path comprises a first flow path formed in a flow direction of the machining-assist gas and generating a supersonic flow of the machining-assist gas; a second flow path connected to the first flow path in the flow direction of the machining-assist gas and expanding a volume of the machining-assist gas having passed through the first flow path; and a flow path boundary defining a boundary between the first flow path and the second flow path.
    Type: Application
    Filed: February 20, 2017
    Publication date: May 13, 2021
    Applicant: HK CO., LTD.
    Inventors: Won Jae LEE, Hak Jae LEE, Sung Jun JO, Yang Jae SHIN
  • Publication number: 20200269350
    Abstract: Disclosed is a nozzle unit for laser processing, which can implement one-touch coupling and separation, thereby enabling easy nozzle replacement and uniform maintenance of a nozzle in a mounted state at an accurate position while preventing damage to a nozzle joint. The nozzle unit for laser processing includes: a nozzle body including a nozzle hole and a coupling protrusion formed at an outer periphery of the nozzle hole; and a nozzle adapter allowing the nozzle body to be inserted into and coupled to a lower portion thereof and including a nozzle coupling portion allowing the coupling protrusion at a first position to be inserted thereinto or separated therefrom and allowing the coupling protrusion at a second position to be seated thereon, the second position being spaced apart from the first position in a circumferential direction of the nozzle hole.
    Type: Application
    Filed: October 29, 2019
    Publication date: August 27, 2020
    Applicant: HK CO., LTD.
    Inventors: Hyo Sang KIM, Hyun Woo YANG, Won Jae LEE
  • Patent number: D920399
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: May 25, 2021
    Assignee: HK CO., LTD.
    Inventors: Jung Hun Shin, Man Sik Park
  • Patent number: D921071
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: June 1, 2021
    Assignee: HK Co., Ltd.
    Inventors: Man Sik Park, Jung Hun Shin
  • Patent number: D1115880
    Type: Grant
    Filed: June 3, 2024
    Date of Patent: March 3, 2026
    Assignee: HK CO., LTD.
    Inventors: Seok Jin Kang, Do Young Kim, Jang Su Yeo, Yang Jae Shin