Patents Assigned to HK CO., LTD.
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Publication number: 20260168099Abstract: The present invention relates to a nozzle installation structure of a laser processing machine that can prevent contaminants such as spatters generated from the laser processing area from flowing into the head through the purge gas discharge gap under the processing head while effectively cooling the nozzle being processed. According to the nozzle installation structure of the laser processing machine of this invention, the purge gas discharged from the purge gas discharge gap at the bottom of the cover body is guided through the purge gas guider and discharged intensively close to the nozzle effectively cooling the nozzle. Meanwhile, most of the contaminants such as spatters generated from the laser processing portion and scattered at high speed are blocked by the spatter blocking plate minimizing the inflow of contaminants such as spatter into the head.Type: ApplicationFiled: June 23, 2023Publication date: June 18, 2026Applicant: HK CO., LTD.Inventors: Su Bin CHOI, Man Sik PARK, Yang Jae SHIN
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Patent number: 11179804Abstract: A laser machining nozzle includes: a nozzle body coupled to a machining head; and a flow path formed through the nozzle body in a longitudinal axis of the nozzle body to allow a machining-assist gas to be injected toward a workpiece therethrough while a laser beam is emitted toward the workpiece, wherein the flow path comprises a first flow path formed in a flow direction of the machining-assist gas and generating a supersonic flow of the machining-assist gas; a second flow path connected to the first flow path in the flow direction of the machining-assist gas and expanding a volume of the machining-assist gas having passed through the first flow path; and a flow path boundary defining a boundary between the first flow path and the second flow path.Type: GrantFiled: February 20, 2017Date of Patent: November 23, 2021Assignee: HK CO., LTD.Inventors: Won Jae Lee, Hak Jae Lee, Sung Jun Jo, Yang Jae Shin
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Publication number: 20210138583Abstract: A laser machining nozzle includes: a nozzle body coupled to a machining head; and a flow path formed through the nozzle body in a longitudinal axis of the nozzle body to allow a machining-assist gas to be injected toward a workpiece therethrough while a laser beam is emitted toward the workpiece, wherein the flow path comprises a first flow path formed in a flow direction of the machining-assist gas and generating a supersonic flow of the machining-assist gas; a second flow path connected to the first flow path in the flow direction of the machining-assist gas and expanding a volume of the machining-assist gas having passed through the first flow path; and a flow path boundary defining a boundary between the first flow path and the second flow path.Type: ApplicationFiled: February 20, 2017Publication date: May 13, 2021Applicant: HK CO., LTD.Inventors: Won Jae LEE, Hak Jae LEE, Sung Jun JO, Yang Jae SHIN
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Publication number: 20200269350Abstract: Disclosed is a nozzle unit for laser processing, which can implement one-touch coupling and separation, thereby enabling easy nozzle replacement and uniform maintenance of a nozzle in a mounted state at an accurate position while preventing damage to a nozzle joint. The nozzle unit for laser processing includes: a nozzle body including a nozzle hole and a coupling protrusion formed at an outer periphery of the nozzle hole; and a nozzle adapter allowing the nozzle body to be inserted into and coupled to a lower portion thereof and including a nozzle coupling portion allowing the coupling protrusion at a first position to be inserted thereinto or separated therefrom and allowing the coupling protrusion at a second position to be seated thereon, the second position being spaced apart from the first position in a circumferential direction of the nozzle hole.Type: ApplicationFiled: October 29, 2019Publication date: August 27, 2020Applicant: HK CO., LTD.Inventors: Hyo Sang KIM, Hyun Woo YANG, Won Jae LEE
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Patent number: D920399Type: GrantFiled: March 6, 2020Date of Patent: May 25, 2021Assignee: HK CO., LTD.Inventors: Jung Hun Shin, Man Sik Park
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Patent number: D921071Type: GrantFiled: September 13, 2018Date of Patent: June 1, 2021Assignee: HK Co., Ltd.Inventors: Man Sik Park, Jung Hun Shin
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Patent number: D1115880Type: GrantFiled: June 3, 2024Date of Patent: March 3, 2026Assignee: HK CO., LTD.Inventors: Seok Jin Kang, Do Young Kim, Jang Su Yeo, Yang Jae Shin