Patents Assigned to HME CO., LTD.
  • Patent number: 9759613
    Abstract: Disclosed are a temperature sensor device using a thermopile, the total number n of thermocouples thereon can be increased without greatly increasing the internal resistance of the thermopile r, providing high output level and high S/N ratio, a highly sensitive radiation thermometer using the device, and production method of the device using organic material for thin films to form the thermopile. These provide a standardized inexpensive multi-layered thin film thermopile, a radiation thermometer with high sensitivity, and production method of these devices. The temperature sensor device is a device wherein a thermopile which is formed on a thin film thermally isolated from a substrate is place in a temperature sensing part, and the thin film is formed as a multi-layered thin film, a layered thermopile is formed on each layered thin film, the substrate functioning as a heat sink which is one junction of the reference temperature of the thermopile.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: September 12, 2017
    Assignees: HME CO., LTD., TOHOKU GAKUIN
    Inventors: Mitsuteru Kimura, Nobuo Tanaka, Hironori Shimobayashi
  • Publication number: 20140036953
    Abstract: Disclosed are a temperature sensor device using a thermopile, the total number n of thermocouples thereon can be increased without greatly increasing the internal resistance of the thermopile r, providing high output level and high S/N ratio, a highly sensitive radiation thermometer using the device, and production method of the device using organic material for thin films to form the thermopile. These provide a standardized inexpensive multi-layered thin film thermopile, a radiation thermometer with high sensitivity, and production method of these devices. The temperature sensor device is a device wherein a thermopile which is formed on a thin film thermally isolated from a substrate is place in a temperature sensing part, and the thin film is formed as a multi-layered thin film, a layered thermopile is formed on each layered thin film, the substrate functioning as a heat sink which is one junction of the reference temperature of the thermopile.
    Type: Application
    Filed: April 26, 2011
    Publication date: February 6, 2014
    Applicants: HME CO., LTD.
    Inventors: Mitsuteru Kimura, Nobuo Tanaka, Hironori Shimobayashi