Abstract: The invention relates to copolymers and molding compounds having reactively bonded sulfur and an overall low sulfur content. The copolymers and molding compounds of the invention are substantially colorless and odorless while sufficiently flame-retardant and can be used in the building industry and electrical industry.

Abstract: The invention relates to a microchip with a multiplicity of reconfigurable test structures, wherein the microchip has a test input (TDI) and a test output (TDO), wherein the multiplicity of test structures can be connected to the test input (TDI) and the test output (TDO), wherein one intermediate memory is provided for each of the multiplicity of test structures, wherein each of the multiplicity of test structures can be tested separately and concurrently with the aid of the respective intermediate memory and a corresponding individual control.

Abstract: The invention relates to a microchip with a multiplicity of reconfigurable test structures, wherein the microchip has a test input (TDI) and a test output (TDO), wherein the multiplicity of test structures can be connected to the test input (TDI) and the test output (TDO), wherein one intermediate memory is provided for each of the multiplicity of test structures, wherein each of the multiplicity of test structures can be tested separately and concurrently with the aid of the respective intermediate memory and a corresponding individual control.