Patents Assigned to Hoden Seimitsu
  • Patent number: 4875264
    Abstract: Dies for extruding honeycomb structures are disclosed, which comprise wear resistant alloy plates, a die base body having a coefficient of thermal expansion different from that of the wear resistant alloy plates, forming channels having a sectional shape conforming to that of honeycomb structural bodies to be extruded and a given depth from a front face of the die toward a rear face thereof, and a plurality of opening holes independently formed from the die near face toward the die front face and communicating with the forming channels. The die base body and the wear resistant alloy plates are bonded together such that the forming channels may communicate with the opening holes. A method for producing such dies is also disclosed, which is characterized in that slits are preliminarily formed in one of machined faces of the die base before the wear resistive alloy plates are bonded to the die base portion, and are located at a predetermined width in an arrangement conforming to the forming channels.
    Type: Grant
    Filed: February 28, 1989
    Date of Patent: October 24, 1989
    Assignees: NGK Insulators, Ltd., Hoden Seimitsu
    Inventors: Satoru Inoue, Shoji Futamura