Patents Assigned to Hoden Semitsu Kako Kenkyusho Co., Ltd.
  • Publication number: 20140193537
    Abstract: Provided are a low-cost and highly-precise structure-molding die that only requires a short production time, and a method of producing the die. The die is characterized by including: a plate-like first member 10 that serves as a base; a second member 2 that has cells 2 of a shape matching a to-be-molded structure and is joined to the first member 10; molding grooves 7 that have a predetermined depth and are disposed between the cells 2; and a supply hole 6 that communicates with the first member 10 at a predetermined intersection of the molding grooves 7 from an opposite side from the cells 2 joined.
    Type: Application
    Filed: August 11, 2011
    Publication date: July 10, 2014
    Applicant: HODEN SEMITSU KAKO KENKYUSHO CO., LTD
    Inventor: Dai Nakagawa
  • Patent number: 7415862
    Abstract: In a press device for pressing a slider with a plurality of motors as driving sources, pressing is performed while a slider is kept horizontal even if an eccentric load is applied.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: August 26, 2008
    Assignee: Hoden Semitsu Kako Kenkyusho Co., Ltd.
    Inventors: Shoji Futamura, Keizo Ohtani