Patents Assigned to Hoffmann + Kripper GmbH
  • Patent number: 8188834
    Abstract: The device has a first substrate on which an electrical resistive element is mounted, and a second substrate on which a contact electrode is mounted. The contact electrode is disposed opposite the resistive element at an electrically insulating distance. It can be brought into electrical contact with the resistive element by pressing the substrates together. The device is provided with electrical or electronic circuitry for detecting the location of the compression point. At least one of the substrates is equipped with a flat leaf spring of spring-grade sheet metal attached flush thereto, which leaf covers the compression zone of the substrates.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: May 29, 2012
    Assignee: Hoffmann + Kripper GmbH
    Inventor: Stefan Berres