Abstract: Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.
Abstract: Proposed are a copper film paste composition including copper particles, a biodegradable resin, a resin for structural reinforcement, a solvent, and an additive. In addition, a flexible copper film formed therefrom is proposed. The flexible copper film is capable of forming a uniform and smooth film, has significantly high bonding strength, and can minimize the environmental impact of waste disposal by using the biodegradable resin.
Type:
Application
Filed:
November 6, 2025
Publication date:
May 21, 2026
Applicant:
Hojeonable Inc.
Inventors:
Beyong Hwan RYU, Yun Soo PARK, Da Hye CHOI, Jong Tae MOON
Abstract: Proposed are a copper sintering paste composition and a method of preparing the same. The copper sintering paste composition can replace conventional bonding material such as solder and lead-free solder and has excellent heat resistance, heat-generating properties, thermal conductivity, and bonding strength.
Abstract: Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.
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