Patents Assigned to Hojeonable Inc.
  • COPPER SINTERING PASTE COMPOSITION AND METHOD OF PREPARING SAME
    Publication number: 20230311250
    Abstract: Proposed are a copper sintering paste composition and a method of preparing the same. The copper sintering paste composition can replace conventional bonding material such as solder and lead-free solder and has excellent heat resistance, heat-generating properties, thermal conductivity, and bonding strength.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 5, 2023
    Applicant: Hojeonable Inc.
    Inventors: Jong Tae Moon, Kwang Mo Jung
  • LIGHT-ABSORBING EPOXY FILM AND MANUFACTURING METHOD THEREOF
    Publication number: 20230131422
    Abstract: Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.
    Type: Application
    Filed: October 21, 2022
    Publication date: April 27, 2023
    Applicant: Hojeonable Inc.
    Inventors: Jong Tae MOON, Kwang Mo JUNG