Abstract: Provided is an electroplating solution of tin or a tin alloy in which the thickness variation of wafer bumps is maintained at a low level even in various changes of plating conditions and thus the mass productivity is improved. The electroplating solution of tin or a tin alloy may include tin ions as metal ions, a conductive salt, a carboxylic acid as a structure refiner, and a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent.
Type:
Grant
Filed:
September 26, 2022
Date of Patent:
January 23, 2024
Assignee:
HOJIN PLATECH CO., LTD.
Inventors:
Woon Suk Jung, Jong Uk Kim, Jin Gyu Lee
Abstract: The present invention relates to plating equipment and method for a solar cell wafer using electroplating and light-induced plating jointly. The plating equipment includes a jig allowing a wafer (1), that is a body to be plated, to be vertically immersed into a plating solution at a center of a plating bath (209), a first plating unit (200) comprising a plurality of anode members (210) symmetrically disposed on both sides of the plating bath (209) facing the wafer (1), the first plating unit performing electroplating; and a second plating unit (300) disposed in a light source receiving unit (320) physically blocked from the first plating unit (200), the second plating unit (300) being disposed at a rear side of the anode members (210) to perform light-induced plating by using an light emitting diode (LED) lamp (301) irradiating light onto the wafer (1).
Type:
Grant
Filed:
February 6, 2014
Date of Patent:
December 20, 2016
Assignee:
HOJIN PLATECH CO., LTD.
Inventors:
Pan Soo Kim, Duk Haeng Lee, Woon Suk Jung
Abstract: The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.
Type:
Grant
Filed:
February 6, 2014
Date of Patent:
October 6, 2015
Assignee:
HOJIN PLATECH CO., LTD.
Inventors:
Pan Soo Kim, Duk Haeng Lee, Woon Suk Jung
Abstract: The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.
Type:
Application
Filed:
February 6, 2014
Publication date:
June 5, 2014
Applicant:
HOJIN PLATECH CO.,LTD.
Inventors:
Pan Soo Kim, Duk Haeng Lee, Woon Suk Jung
Abstract: The present invention relates to plating equipment and method for a solar cell wafer using electroplating and light-induced plating jointly. The plating equipment includes a jig allowing a wafer (1), that is a body to be plated, to be vertically immersed into a plating solution at a center of a plating bath (209), a first plating unit (200) comprising a plurality of anode members (210) symmetrically disposed on both sides of the plating bath (209) facing the wafer (1), the first plating unit performing electroplating; and a second plating unit (300) disposed in a light source receiving unit (320) physically blocked from the first plating unit (200), the second plating unit (300) being disposed at a rear side of the anode members (210) to perform light-induced plating by using an light emitting diode (LED) lamp (301) irradiating light onto the wafer (1).
Type:
Application
Filed:
February 6, 2014
Publication date:
June 5, 2014
Applicant:
HOJIN PLATECH CO., LTD.
Inventors:
Pan Soo Kim, Duk Haeng Lee, Woon Suk Jung