Abstract: A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—C—N layer. Then, Ce ions are implanted in the Al—C—N layer by ion implantation process. The atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided.
Type:
Grant
Filed:
August 30, 2011
Date of Patent:
December 3, 2013
Assignees:
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.
Abstract: A packing mechanism includes a plurality of first connecting members connecting end to end to form a polygon; and a plurality of sidewalls mounted on the first connecting members. Each first connecting member includes a main body, and a fixing portion mounted on an end of the main body. The main body defines at least two latching portions and at least one connecting portion. Each sidewall includes a base body and at least one positioning portion formed at an end of the base body, and the positioning portion latches with the connecting portion of the corresponding first connecting member. The fixing portion engages with one of the latching portions of an adjacent first connecting member; such that a volume of the packing mechanism is adjustable by engaging the fixing portion with another one of the latching portions of the adjacent first connecting members.
Type:
Grant
Filed:
March 23, 2012
Date of Patent:
August 6, 2013
Assignees:
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.
Abstract: A direct backlight module includes a light optical plate, a plurality of point light sources, and a reflective member. The optical plate includes a light input surface and a light output surface opposite to the light output surface. The point light sources are positioned between the optical plate and the reflective member. The reflective element forms a plurality of curved reflective surfaces corresponding to the point light sources. Each curved reflective surface is a substantially spherical depression, and each point light source corresponds to a center of each spherical depression defined by one of the curved reflective surfaces.
Type:
Grant
Filed:
March 18, 2009
Date of Patent:
September 6, 2011
Assignees:
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.
Abstract: A card for simulating peripheral component interconnect (PCI) loads of a computer motherboard uses a PCI interface to be inserted into a PCI slot of the computer motherboard to receive first to third voltage signals from the computer. First to third load modules of the card receive voltage signals from the computer via the PCI interface to simulating first to third power consumption of the computer.
Type:
Grant
Filed:
July 15, 2009
Date of Patent:
August 2, 2011
Assignees:
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.