Patents Assigned to Hon Hai Precision Industy Co., Ltd.
  • Patent number: 8597804
    Abstract: A housing is provided which includes an aluminum or aluminum alloy substrate, an aluminum layer and a corrosion resistant layer formed on the aluminum or aluminum alloy substrate in that order. The corrosion resistant layer is an Al—C—N layer. Then, Ce ions are implanted in the Al—C—N layer by ion implantation process. The atomic percentages of N and C in the Al—C—N gradient layer gradually increase from the side of Al—C—N gradient layer near the aluminum or aluminum alloy substrate to the other side of Al—C—N gradient layer, away from aluminum or aluminum alloy substrate. Therefore the housing has a high corrosion resistance. A method for making the housing is also provided.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: December 3, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Yi-Chi Chan, Xiao-Qiang Chen
  • Patent number: 8499954
    Abstract: A packing mechanism includes a plurality of first connecting members connecting end to end to form a polygon; and a plurality of sidewalls mounted on the first connecting members. Each first connecting member includes a main body, and a fixing portion mounted on an end of the main body. The main body defines at least two latching portions and at least one connecting portion. Each sidewall includes a base body and at least one positioning portion formed at an end of the base body, and the positioning portion latches with the connecting portion of the corresponding first connecting member. The fixing portion engages with one of the latching portions of an adjacent first connecting member; such that a volume of the packing mechanism is adjustable by engaging the fixing portion with another one of the latching portions of the adjacent first connecting members.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: August 6, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.
    Inventor: Zi-Ming Tang
  • Patent number: 8011795
    Abstract: A direct backlight module includes a light optical plate, a plurality of point light sources, and a reflective member. The optical plate includes a light input surface and a light output surface opposite to the light output surface. The point light sources are positioned between the optical plate and the reflective member. The reflective element forms a plurality of curved reflective surfaces corresponding to the point light sources. Each curved reflective surface is a substantially spherical depression, and each point light source corresponds to a center of each spherical depression defined by one of the curved reflective surfaces.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: September 6, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.
    Inventors: Yen-Ping Tien, Zuo Chai, Gwo-Yan Huang
  • Patent number: 7990157
    Abstract: A card for simulating peripheral component interconnect (PCI) loads of a computer motherboard uses a PCI interface to be inserted into a PCI slot of the computer motherboard to receive first to third voltage signals from the computer. First to third load modules of the card receive voltage signals from the computer via the PCI interface to simulating first to third power consumption of the computer.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: August 2, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industy Co., Ltd.
    Inventors: Hai-Qing Zhou, Chung-Chi Huang