Abstract: A camera module includes a housing, a wafer level module (WLM), a liquid crystal panel, and an image sensor. The housing includes a top surface and a bottom surface facing away from the top surface. The housing defines a through hole running through the top surface and the bottom surface. The WLM is received in the through hole, and includes a lens barrel and at least one lens received in the lens barrel. The lens barrel includes an upper surface and a lower surface facing away from the upper surface. The liquid crystal panel is received in the through hole and positioned on the upper surface. The image sensor is received in the through hole and connected to the lower surface.

Abstract: The present disclosure provides a printed circuit board (PCB) with grounding protection. The PCB includes a grounding element. A predetermined number of via through holes or a predetermined number of soldering tin joints are distributed around the grounding element to generate a good grounding protection for the PCB.

Abstract: A hinge assembly includes a pivot shaft defining a latching recess, a second leaf non-rotatably connected to the pivot shaft, a first leaf rotatably connected to the pivot shaft, and a clasping member fixed on the first leaf. The clasping member includes a receiving portion sleeved on the pivot shaft, and an elastic portion adjacent to the receiving portion. A part of the elastic portion engages in the latching recess of the pivot shaft, and the part of the elastic portion is separated from the receiving portion.