Patents Assigned to HONG FU JIN PRECISION INDUSTRY (ShenZhen City) CO., LTD.
  • Publication number: 20120132772
    Abstract: A mounting apparatus for mounting a circuit board to a bottom plate includes a positioning member, a mounting member and a maintaining member; the mounting member is mounted to the positioning member and adapted to removably mount the positioning member to the bottom plate; the maintaining member defines a top surface and a bottom surface, and a maintaining piece extends from the bottom plane; the positioning member defines a first maintaining plane and a second maintaining plane, and a distance between the first maintaining plane and the bottom plate is larger than that between the second maintaining plane and the bottom plate; the maintaining member is mounted to the positioning member in a first position, where the maintaining piece abuts the second maintaining plane, or a second position, where the maintaining piece abuts the first maintaining plane; the circuit board abuts the top surface of the maintaining member.
    Type: Application
    Filed: July 21, 2011
    Publication date: May 31, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen City) CO., LTD.
    Inventors: PO-WEN CHIU, WEN-HU LU, ZHAN-YANG LI