Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a dielectric layer, a power layer, a ground layer, and an electromagnetic interference reducing layer. The dielectric layer includes a central portion and a periphery portion surrounding the central portion. The dielectric layer defines a number of via holes through the periphery portion. The ground layer is adhered to a surface of the dielectric layer, covering both the central portion and the periphery portion. The power layer and the EMI reducing layer are separately adhered to another surface of the dielectric layer facing away from the conductive ground layer. The conductive power layer covers the central portion. The EMI reducing layer substantially covers the periphery portion and is electrically connected to the ground layer via the via holes.
Type:
Application
Filed:
August 7, 2009
Publication date:
April 29, 2010
Applicants:
HONG FU JIN PRECISION INDUSTRY(ShenZheng) CO., LTD., HON HAI PRECISION INDUSTRY CO.,LTD.
Abstract: A support assembly for a portable device includes a base (10), a support body (20) and a holder (30) for holding the portable device. The support body extends from the base. A protrusion (25) is formed on the support body. The holder defines a cutout (37) and a groove (375). The cutout receives the support body. The protrusion of the support body slides into the groove of the holder to detachably mount the holder to the support body.
Type:
Grant
Filed:
October 5, 2005
Date of Patent:
July 3, 2007
Assignees:
Hong Fu Jin Precision Industry (Shenzheng) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
Inventors:
Yun-Lung Chen, Pei-Bin Luo, Ming-Xian Sun, Gang Su