Patents Assigned to Hong Fu Jin Precision Industry (Shenzheng) Co., Ltd.
  • Publication number: 20100101841
    Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a dielectric layer, a power layer, a ground layer, and an electromagnetic interference reducing layer. The dielectric layer includes a central portion and a periphery portion surrounding the central portion. The dielectric layer defines a number of via holes through the periphery portion. The ground layer is adhered to a surface of the dielectric layer, covering both the central portion and the periphery portion. The power layer and the EMI reducing layer are separately adhered to another surface of the dielectric layer facing away from the conductive ground layer. The conductive power layer covers the central portion. The EMI reducing layer substantially covers the periphery portion and is electrically connected to the ground layer via the via holes.
    Type: Application
    Filed: August 7, 2009
    Publication date: April 29, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY(ShenZheng) CO., LTD., HON HAI PRECISION INDUSTRY CO.,LTD.
    Inventor: FA-PING FAN
  • Patent number: 7238042
    Abstract: A support assembly for a portable device includes a base (10), a support body (20) and a holder (30) for holding the portable device. The support body extends from the base. A protrusion (25) is formed on the support body. The holder defines a cutout (37) and a groove (375). The cutout receives the support body. The protrusion of the support body slides into the groove of the holder to detachably mount the holder to the support body.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: July 3, 2007
    Assignees: Hong Fu Jin Precision Industry (Shenzheng) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Pei-Bin Luo, Ming-Xian Sun, Gang Su