Abstract: A cooling module is used to cool an electronic component, the cooling module includes a shell and a radiator which is received in the shell. The shell includes a receiving portion which is used to receive the radiator. Two sides of the receiving include two latch pieces, the latch piece defines a latch hole. Two sides of the radiator include two protrusive blocks, the latch piece can be elastically deformed to let the protrusive block be inserted into the latch hole to fix the radiator in the shell.
Type:
Grant
Filed:
April 20, 2015
Date of Patent:
June 6, 2017
Assignees:
HONG FU JIN PRECISON INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.