Patents Assigned to Hong Kong Applied Science and Technology Researh Institute Co. Ltd.
  • SUBSTRATE WARPAGE-REDUCING STRUCTURE
    Publication number: 20100247879
    Abstract: The subject matter disclosed herein relates to methods to reduce warpage of a substrate.
    Type: Application
    Filed: March 26, 2009
    Publication date: September 30, 2010
    Applicant: Hong Kong Applied Science and Technology Researh Institute Co. Ltd.
    Inventors: Jyh-Rong Lin, Bin Xie, Yeung Yeung, Xunqing Shi, Chang Hwa Chung