Patents Assigned to Hong Kong Polytechnic University, The
  • Patent number: 7452158
    Abstract: The invention relates to an infill which can be inserted into a bollard footing hole. The infill is designed such that it allows a bollard to be fit over it, and the infill fits within a footing hole. Methods of covering a footing hole are also bought.
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: November 18, 2008
    Assignee: Hong Kong Polytechnic University, The
    Inventor: Kin Wai Michael Siu