Patents Assigned to Hong Kong Science and Technology Research Institute Company Limited
  • Patent number: 8907227
    Abstract: The present invention relates to a device with portions of the device on plural substrate surfaces. The device includes a low resistivity substrate having first and second surfaces with a first electrically-conductive device component disposed over a first surface. An intermediate electrically-insulating layer may be disposed between the electrically-conductive component and the low resistivity substrate. A second electrically-conductive component is disposed over the second surface of the low resistivity substrate. A cavity formed in the low resistivity substrate is at least partially filled with a high resistivity material. One or more electrically-conducting pathways are formed in the high resistivity material electrically connecting the first electrically conductive component and the second electrically-conductive component to form a device. Exemplary devices include inductors, capacitors, antennas and active or passive devices incorporating such devices.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: December 9, 2014
    Assignee: Hong Kong Science and Technology Research Institute Company Limited
    Inventors: Ruonan Wang, Yan Liu, Song He, Tingting Wang