Abstract: A composite semiconductive thermoelectric refrigerating module comprises dozens or hundreds composite P-N couples which are electrically connected in series to form an array of required configuration which is fixed with electrical and thermal insulator and combined with the heat absorber and a thermal radiator, respectively, by thermoconductive greased films of electrical insulation. The refrigerating device is characterized by a good conductor sandwiched between the semiconductor head parts of a thermoelectric element by surface-to-surface brazing. This device can be substituted for small sized vapor compression refrigerating devices. The first embodiment of the invention is of circular configuration, while the second embodiment is rectangular. Other embodiments of specific configurations in accordance with requirements can also be constructed.