Patents Assigned to HONMOUNTECH CO., LTD.
  • Patent number: 9738061
    Abstract: A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: August 22, 2017
    Assignee: HONMOUNTECH CO., LTD.
    Inventor: Yi-Fan Liang