Abstract: Packaging with heat-shrinkable film wherein an article has on its surface a heat-shrinkable film in the longitudinal or traversing direction, a tape-shaped overlapping portion is formed on said film, the tape-shaped overlapping portion is partially welded, and tear-off perforations are made in lines along the longitudinal direction thereof so that tearing off the tape-shaped overlapping portion along the perforations opens the package to allow the article to be taken out.
Type:
Grant
Filed:
January 2, 1991
Date of Patent:
November 26, 1991
Assignees:
Honshu Sangyou Kabushiki Kaisha, Honshu Paper Co., Ltd.