Patents Assigned to Hoosier Laser, Inc.
  • Patent number: 9902019
    Abstract: A laser workpiece cutting system for performing a laser cutting operation on a workpiece. The laser workpiece cutting system includes a modular support unit configured to be easily assembled and disassembled. The modular support unit includes a plurality of individual components, which when assembled, are configured to support one or more workpieces for laser cutting. A frame includes siderails configured to support a plurality of support rails, each of which includes a plurality of pins configured to support and align one or more workpiece fixtures. The workpiece fixtures, in different embodiments, are adapted to support a wide variety of different types of workpieces including, glassware, writing instruments, leather products, novelty items, toys, and utensils.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: February 27, 2018
    Assignee: Hoosier Laser, Inc.
    Inventor: David L. Schwartz