Patents Assigned to HORIKAWA INDUSTRY CO., LTD.
  • Patent number: 11278945
    Abstract: A die set for bending a metal plate workpiece includes a lower die for placing the workpiece, an upper die having a pressing surface which presses the workpiece toward the lower die by movement, a lower movable part provided in the lower die and being slidable in the same direction as the direction of the upper die movement, and a gas spring elastically supporting the lower movable part from below. The pressing surface of the upper die is moved, contacts with the upper surface of the workpiece and presses the workpiece toward the lower die. The lower movable part being elastically supported by the gas spring from below brings an opposing surface into contact with the lower surface of the workpiece and makes the upper die to be close to the lower die while applying force in the upward which is opposite direction of the upper die movement.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: March 22, 2022
    Assignees: NIKKEIKIN ALUMINUM CORE TECHNOLOGY COMPANY, LTD., NIPPON LIGHT METAL COMPANY, LTD., HORIKAWA INDUSTRY CO. LTD.
    Inventors: Mitsunori Kato, Toshiaki Yamazaki, Eiji Anzai, Shoichi Horikawa, Hiroyuki Horikawa
  • Patent number: D914775
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: March 30, 2021
    Assignees: NIKKEIKIN ALUMINIUM CORE TECHNOLOGY COMPANY, LTD., NIPPON LIGHT METAL COMPANY, LTD., HORIKAWA INDUSTRY CO., LTD.
    Inventors: Mitsunori Kato, Toshiaki Yamazaki, Eiji Anzai, Shoichi Horikawa, Hiroyuki Horikawa