Patents Assigned to Hosakawa Micron Corporation
  • Patent number: 6523763
    Abstract: The present invention concerns a process for producing thermoplastic resin granules, comprising compression-molding a powdery raw material of a thermoplastic resin, which is obtained by polymerizing a plurality of materials and then drying the obtained polymer by passing the powdery raw material between two rolls arranged parallel with a minute gap therebetween at a temperature of 40° C. or higher, and crushing the obtained compression-molded product into granules having grain diameter of 10 mm or less, wherein concavities are formed all around the rolls so as to be arrayed in a direction inclined relative to axes of the rolls, the concavities each having an elliptical opening of which a major-axis diameter measures 10 mm or less.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: February 25, 2003
    Assignee: Hosakawa Micron Corporation
    Inventor: Chuichi Mizoguchi