Abstract: A chip stacking and packaging structure includes a substrate, a first chip stacked on the substrate, a heat dissipation module, and a second chip stacked on the heat dissipation module. First bonding pads and second bonding pads are arranged on the substrate. First welding pins are arranged on the first chip. The first welding pins one-to-one cover and are one-to-one electrically connected to the first bonding pads. The heat dissipation module includes a first groove, a cooling liquid cavity, a liquid inlet, a liquid outlet, and first conductive columns. The first chip is embedded in the first groove. A side wall and a bottom wall of the first groove extend into the cooling liquid cavity. Each of the first conductive columns is electrically connected with a corresponding second bonding pad. Each of second welding pins of the second chip is electrically connected to a corresponding first conductive column.

Abstract: The present disclosure provides a chip packaging device, a chip packaging method, and a package chip, and is related to a technical field of chip packaging. The chip packaging device includes conductive sheets, a vacuum suction movable assembly defining a variable suction surface, and a heating assembly. The variable suction surface sucks the plurality of conductive sheets. A first end of each of the conductive sheets is disposed above a corresponding bonding pads. A second end of each of the conductive sheets is disposed above a corresponding welding pin, so that when the variable suction surface is pressed down, the first end of each of the conductive sheets is pressed onto the corresponding bonding pad, and the second end of each of the conductive sheets is pressed onto the corresponding welding pin. The heating assembly heats solders on the bonding pads and the welding pins.

Abstract: A storage device and a storage control method where the storage device includes a flash memory controller, an artificial intelligence (AI) processor and a flash memory storage chip set. The flash memory controller is connected with the AI processor and the flash memory storage chip set separately. The flash memory controller is configured to send original data to be stored to the AI processor when receiving an AI extension instruction from a host, and store tag data from the AI processor in the flash memory storage chip set. The AI processor is configured to convert the original data from the flash memory controller into the tag data by a predetermined algorithm and send the tag data to the flash memory controller. The flash memory controller stores the tag data in the flash memory storage chip set.