Patents Assigned to Hosokawa Seisakushi Company, Ltd.
  • Patent number: 5238392
    Abstract: A pressure molding apparatus for supplying molten resin to a mold includes a gate unit having an aperture therein for passage of molten resin into a mold cavity of the mold, a gate pipe connected for communication with the gate unit, and a gate pin which is axially movable within the gate pipe. The gate pin has a gate pin end at one end and a tip at another end thereof, the tip being engageable with the aperture for controlling flow of molten resin through the gate unit. The apparatus also includes a manifold pipe for supplying molten resin to the gate pipe, a connection arrangement for connecting the gate pipe to the manifold pipe. The connection arrangement includes a receiving portion for receiving molten resin from the manifold pipe, the gate pin passing completely through the receiving portion and the gate pin end extending beyond the connection arrangement.
    Type: Grant
    Filed: March 18, 1992
    Date of Patent: August 24, 1993
    Assignee: Hosokawa Seisakushi Company, Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda