Patents Assigned to Hosokawa Seisakusho Co., Ltd.
  • Patent number: 5714175
    Abstract: An apparatus for producing a multilayer molded article including a resin body and at least one sheet of a skin material, an edge part of which is present in a surface area of the resin body. The apparatus includes a mold, and a clamping device for clamping an edge part of a skin material or mated edge parts of adjacent skin materials during molding.
    Type: Grant
    Filed: November 30, 1995
    Date of Patent: February 3, 1998
    Assignees: Sumitomo Chemical Co., Ltd., Hosokawa Seisakusho Co., Ltd.
    Inventors: Shohei Masui, Masahito Matsumoto, Nobuhiro Usui, Toshihiro Hosokawa, Ryuichi Ishitsubo
  • Patent number: 5622667
    Abstract: A process is provided for producing a skin-integrated laminate using a mold assembly in which a female mold 1 is arranged above and facing a male mold 2 so as to be freely brought close to and away from the male mold, wherein the female mold 1 and the male mold 2 are arranged so as to form an end opening at the peripheral end of a cavity 11 when they are clamped, a plate mold 4 having an end-forming pointed end part 5 which can enter the above end opening is also provided, and the end of the skin material allowed to exist between the male mold 2 and the female mold 1 is clamped with a clamping mechanism 3 which can be freely opened and closed, whereby the skin material is adhered integratedly in layer to the molded synthetic resin substrate from its one side to the other end surface simultaneously with the forming of the substrate and whereby a skin-integrated laminate exhibiting a good appearance, whose skin material does not shrink even after the molding, can be produced in a good efficiency, and a mold ass
    Type: Grant
    Filed: October 13, 1994
    Date of Patent: April 22, 1997
    Assignees: Sumitomo Chemical Company, Limited, Takashimaya Nippatsu Kogyo Co., Ltd., Hosokawa Seisakusho Co., Ltd.
    Inventors: Youichi Fujiyama, Takashi Watanabe, Masahito Matsumoto, Ryuichi Ishitsubo
  • Patent number: 5545023
    Abstract: A pressure molding apparatus for molten resin in which an oil-pressurized cylinder internally holding an end of gate pin can freely move in compatibility with thermal elongation or contraction of a manifold pipe. In addition, a limit switch to be activated by the descending movement of this cylinder in correspondence with the descending movement of the gate pin is interlinked to a molten-resin supply source. By provision of these mechanisms, molten resin can smoothly be delivered to the interior of a molding unit without obstruction. Since substantial space is provided around this cylinder, pipes can easily be installed. Furthermore the inner later surface of the gate aperture on the side of the gate pin is provided with an obtuse angle wider than the tip angle of the gate pin, and a tapered hole having an adequate length and tapered diameter expanding itself from the gate aperture to the inner surface of the molding unit is provided.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: August 13, 1996
    Assignee: Hosokawa Seisakusho Co. Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda
  • Patent number: 5338182
    Abstract: This invention is directed to a pressure molding apparatus for molten resin in which an oil-pressurized cylinder internally holding an end of gate pin can freely move in compatibility with thermal elongation or contraction of a manifold pipe. In addition, a limit switch to be activated by the descending movement of this cylinder in correspondence with the descending movement of the gate pin is interlinked to a molten-resin supply source. By provision of these mechanisms, molten resin can smoothly be delivered to the interior of a molding unit without obstruction. Since substantial space is provided around this cylinder, pipes can easily be installed. Furthermore, the inner lateral surface of the gate aperture on the side of the gate pin is provided with an obtuse angle wider than the tip angle of the gate pin, and a tapered hole having an adequate length and tapered diameter expanding itself from the gate aperture to the inner surface of the molding unit is provided.
    Type: Grant
    Filed: March 24, 1992
    Date of Patent: August 16, 1994
    Assignee: Hosokawa Seisakusho Co., Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda
  • Patent number: 5234336
    Abstract: The invention provides a pressure molding apparatus for molten resin capable of efficiently maintaining the temperature of molten resin in the gate pipe, which is provided with molten-resin feeding gate pipes beneath the gate aperture of a molding unit composed of upper and lower molds in order that molten resin can be delivered to the interior of the molding unit before being pressed and molded, where the heater unit for maintaining the temperature of molten resin is disposed in the external periphery of the gate pipes in the state of being divided into two units in the vertical direction. Opposite portions of the gate pipe vertically being divided into two units are connected to each other so that length can optionally be adjusted to the extended or contracted direction, wherein the heater unit is discretely provided in the periphery of the gate pipes which are separately disposed.
    Type: Grant
    Filed: June 12, 1990
    Date of Patent: August 10, 1993
    Assignee: Hosokawa Seisakusho Co., Ltd.
    Inventors: Toshihiro Hosokawa, Kiyoshi Nakahara, Ryuichi Ishitsubo, Toshiyuki Okuda
  • Patent number: 5122320
    Abstract: A multilayer molded article including a resin body and a skin material having little or no wrinkles or breakage in the skin material is molded by molding a resin melt and the skin material in the mold while removing the air trapped between the skin material and the mold.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: June 16, 1992
    Assignees: Sumitomo Chemical Co., Ltd., Hosokawa Seisakusho Co., Ltd.
    Inventors: Shohei Masui, Masahito Matsumoto, Nobuhiro Usui, Toshihiro Hosokawa, Ryuichi Ishitsubo