Patents Assigned to Hotronic International Limited
  • Publication number: 20110127249
    Abstract: There is described an electric heating element for insoles of footwear is provided which comprises a flexible, generally flat sheet of material. The sheet of material is provided across its surface with heating means. The heating means is connected with a number of flat electrodes for electric direct current, and includes positive and negative electrodes which are electrically connectable to a positive and a negative power line, respectively. The heating means is of a planar, continuous configuration and adapted to produce heat when electric direct current flows therethrough.
    Type: Application
    Filed: November 27, 2009
    Publication date: June 2, 2011
    Applicant: Hotronic International Limited
    Inventor: Daniel Lopez TENIAS
  • Patent number: 6657164
    Abstract: Heated insoles are presented in the form of separate packages that will combine into a kit to make a heated insole for footwear. One package contains a heating assembly made of a heating element, a flexible power cable ending in an electrical connector, and (optionally) a power pack that contains a rechargeable battery, a rheostat, and a mating electrical connector. The other package contains a flexible, cushioned insole having a sealable opening and guide channel on the bottom. Once a suitable sized insole is selected, the heating element is inserted into a sealable opening in the insole that is dimensioned to receive the heating element and sealed therein. This kit and manner of construction allows retailers to stock fewer heating elements than insole sizes so as to reduce inventory costs.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: December 2, 2003
    Assignee: Hotronic International Limited
    Inventor: Albin G. Koch