Abstract: A component tape comprising a base tape that includes pockets configured to house electrical components for placement on a printed circuit board and a cover tape, covering the base tape wherein a portion of the cover tape is configured to engage with a tape engagement feature of a component tape feeder.

Abstract: Provided is a component tape feeder apparatus comprising a single output module, a single component exposure module, operably connected to the single output module, and, a plurality of input modules, wherein each input module of the plurality of input modules is operably connected to the single exposure module. A corresponding method of feeding electronic components includes supplying a plurality of component tapes housing electronic components to the single exposure module, wherein the supplying involves receiving and forwarding of the plurality of component tapes by the plurality of input modules.

Abstract: A component tape comprising a base tape that includes pockets configured to house electrical components for placement on a printed circuit board and a cover tape, covering the base tape wherein a portion of the cover tape is configured to engage with a tape engagement feature of a component tape feeder.

Abstract: The present invention is an apparatus for multiple-pitch carrier tape feeding, including a carrier tape reel support, a slidable tape window and cover tape peel edge for exposing a component at a pick location adjacent a peel edge, and a carrier tape drive mechanism for advancing the carrier tape through the tape guide. The feeder also includes a pitch selection cam having a plurality of positions, each corresponding to one of a plurality of carrier tape pitch sizes, wherein movement of said selection cam is directly translated into movement of the tape guide. A sensor is employed for detecting the position of the selection cam, and a control unit, responsive to the sensor, controls the carrier tape drive, thereby advancing the carrier tape a predetermined distance according to the selected pitch size.

Abstract: The present invention is a method and apparatus for parting and peeling-back the cover tape on a carrier tape (consisting of a component tape with pockets therein and cover tape thereover) in order to expose the component for retrieval by an automated assembly system. More specifically, the cover tape is parted along one edge, or slit in the middle for wider component tapes. The cover tape flap(s) created by the parting operation are then retracted back away from the region above the component, whereby the component is exposed for retrieval at the pick-up location. Subsequent to the pick-up location the carrier tape, with the parted cover tape flap(s) still attached thereto, is directed to a waste receptacle or similar disposal mechanism, avoiding the need for a separate cover tape take-up reel.

Abstract: A direct die feeder picks known good die from a wafer and places them on a conveyor belt, which conveys the die to a pickup location. Frame (111) supports a wafer (105) which is a wafer that is sawed while adhered onto a flexible film, which is then stretched and mounted in a ring (110). A fork member (125), on which a pick head (150) is mounted slides along a horizontal axis and frame (111) slides along a vertical axis to allow the pick head (150) to access any die from the wafer. A camera (160) is directed downward at a 45° mirror (162) adjacent to the pick head to capture images of the wafer and determine the precise locations of die and qualify them. The pick head (150) can pick die from the wafer and place them directly on the conveyor belt (170) in the conventional orientation, or pass the die to a flip head (140) which then shifts to the left and lowers the die down past the pick head, placing the die on the conveyor belt in the flipped orientation.

Abstract: In a variable-pitch tape feeder for feeding parts to a pick and place machine used to produce electronic circuit boards, a switch assembly is provided which controls the limits of a shutter movement and the tape advance distance dependent upon the desired pitch. The tape feeder uses a carrier tape to deliver parts to the pick and place machine. The parts are inserted into depressions at regular intervals along the length of the tape. To accommodate tapes of varying pitches, i.e., distances between parts, the feeder uses an electronic control unit to drive the tape feed mechanism and actuate a shutter. The shutter prevents small parts from escaping their respective depressions prematurely. The switch provides a stop surface which limits the rearward travel of the shutter and a flag which is detected by optical sensors to determine the position of the switch and thus the pitch desired by the operator.

Abstract: A direct die feeder picks known good die from an expanded wafer and places them on a conveyor belt, which conveys the die to a pickup location. Frame (111) supports an expanded wafer (105) which is a wafer that is sawed and adhered onto a flexible film, which is then stretched and mounted in a ring (110). A fork member (125), on which a pick head (150) is mounted slides along an x-axis and frame (111) slides along a vertical axis to allow the pick head (150) to access any die from the expanded wafer. A camera (160) is directed downward at a 45.degree. mirror adjacent to the pick head to capture images of the wafer and determine the precise locations of known good die on the wafer. The pick head (150) can pick die from the wafer and place them directly on the conveyor belt (170) in the conventional orientation, or pass the die to a transfer head (155) which then shifts to the left and lowers the die down past the pick head, placing the die on the conveyor belt in the flipped orientation.