Abstract: The present invention relates to a nozzle for cleaning a substrate by discharging cleaning liquid to the substrate and a method of manufacturing the nozzle and, more particularly, to a nozzle for cleaning a substrate and a method of manufacturing the nozzle, the nozzle having pressure resistance performance capable of enduring high supply pressure of the cleaning liquid.
Abstract: The present invention relates to a nozzle for cleaning a substrate by discharging cleaning liquid to the substrate and a method of manufacturing the nozzle and, more particularly, to a nozzle for cleaning a substrate and a method of manufacturing the nozzle, the nozzle having pressure resistance performance capable of enduring high supply pressure of the cleaning liquid.
Abstract: The present invention relates to a nozzle for cleaning a substrate capable of spraying deionized water for cleaning a substrate to the substrate, the nozzle including a first body made of a resin material and provided with a first part of a deionized water passage and a deionized water supply hole to supply the deionized water, a second body made of a resin material and provided with a second part of the deionized water passage and a plurality of spray holes to spray the deionized water to the substrate, a fusible protrusion provided in the first body or the second body along the deionized water passage and configured such that a part thereof is fused during ultrasonic welding, so as to couple the first body and the second body together, and a fusible protrusion accommodating part formed in the first body or the second body to accommodate the fusible protrusion.
Type:
Grant
Filed:
November 21, 2018
Date of Patent:
March 9, 2021
Assignee:
HS HI-TECH CO., LTD.
Inventors:
Man Ho Han, Young Min Ju, Guk Ki Ahn, Yun Deok Kim