Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
Type:
Grant
Filed:
April 2, 2014
Date of Patent:
April 25, 2017
Assignee:
HSBC Bank USA, National Association
Inventors:
Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
Abstract: Embodiments of the invention describe an electronic method for processing stranded payments and lockbox payments at the same designated payment location. The method includes receiving a stranded payment at a non-designated payment location, and electronically scanning the stranded payment at the non-designated payment location. The scanned information is transmitted, in a secure manner, to a designated payment location remote from the non-designated payment location. The stranded payment and a lockbox payment are cleared, in the same electronic workflow, the transmitted information is used in the clearing process. Embodiments of the invention also include updating, for each stranded and lockbox payment, the accounts receivable system of the customer receiving the stranded or lockbox payment, and transmitting a response indicating the final status of the clearing of the stranded payment to the non-designated payment location.
Abstract: Embodiments of the invention describe an electronic method for processing stranded payments and lockbox payments at the same designated payment location. The method includes receiving a stranded payment at a non-designated payment location, and electronically scanning the stranded payment at the non-designated payment location. The scanned information is transmitted, in a secure manner, to a designated payment location remote from the non-designated payment location. The stranded payment and a lockbox payment are cleared, in the same electronic workflow, the transmitted information is used in the clearing process. Embodiments of the invention also include updating, for each stranded and lockbox payment, the accounts receivable system of the customer receiving the stranded or lockbox payment, and transmitting a response indicating the final status of the clearing of the stranded payment to the non-designated payment location.
Abstract: A method of improving the sensitometric response of a photosensitive imaging media under various humidity conditions including the steps of providing a photosensitive imaging media including an imaging layer comprising a developer material and a plurality of microcapsules encapsulating a photohardenable composition and a color former; image-wise exposing the imaging media to actinic radiation to form a latent image on the media; maintaining the imaging media containing the latent image at an elevated temperature; and developing the image.
Type:
Grant
Filed:
November 20, 2001
Date of Patent:
October 28, 2003
Assignee:
HSBC Bank USA
Inventors:
Alexander Y. Polykarpov, Joseph C. Camillus, James A. Dowler, Julius D. King, Jr.