Patents Assigned to Hsiang Chang
  • Inorganic packaging module having a chip encapsulated therein
    Patent number: 10636718
    Abstract: A packaging module includes a substrate, a chip firmly mounted on the substrate, a frame firmly connected to the substrate via a gold-to-gold bonding and a cover firmly connected to the frame via the same gold-to-gold bonding. With the inorganic bonding structure, the packaging module is able to endure high temperature and high pressure without the worry of bonding agent being damaged by environmental condition change.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: April 28, 2020
    Assignee: Chang Sheng Hsiang Chang
    Inventor: Sheng Hsiang Chang
  • Wrist watch
    Patent number: D385201
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: October 21, 1997
    Assignee: Hsiang Chang
    Inventor: Aaron Jou
  • Watch
    Patent number: D414429
    Type: Grant
    Filed: March 12, 1997
    Date of Patent: September 28, 1999
    Assignee: Hsiang Chang
    Inventor: Jeff Liao
  • Mobile device case
    Patent number: D713847
    Type: Grant
    Filed: September 9, 2012
    Date of Patent: September 23, 2014
    Assignee: Fu-Hsiang Chang
    Inventor: I-Hsuan Su