Abstract: A heat sink fin assembly structure, suitable for various kinds of computer chip sets or processors, mainly has a plurality of heat sink fins assembled to form a plurality of upright and parallel heat sink fins on a base seat of the heat sink. The present invention is characterized that a lateral rim on a bottom portion of a piece-shaped main body of the heal sink fin extends to form a connection piece. A plurality of position holes are drilled on the connection piece and side rims thereof bend upwards from a plurality of position pieces and holding pieces. A second heat sink fin is assembled to the lateral sides of a first heat sink fin such that the heat sink fins fix and connect each other thereby eliminating the need of molding and extruding the heat sink so as to achieve the effect of cost saving.

Abstract: A cooling fin assembly according to the invention includes a plurality of cooling fins joined with one another for forming a plurality of vertical and parallel cooling fins mounted on a base of a heat sink. Wherein, two sides at a bottom portion of a main body of each cooling fin are provided with a clasp piece, respectively, a bottom edge of the main body is transversely extended and formed with a connecting piece, and an edge of the connecting piece is further formed with a positioning piece by folding upward. When a second cooling fin is butted against a side edge of the positioning piece of a second cooling fin, the clasp piece of the second cooling fin is clasped at the positioning piece of the first cooling fin, thereby fastening and joining the cooling fins to one another.