Abstract: An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.
Abstract: A package for at least one semiconductor device and a method for making the package. At least one dielectric layer is selectively printed on at least a portion of the semiconductor device creating first recesses aligned with a plurality of the electrical terminals. A conductive material is printed in the first recesses forming contact members on the semiconductor device. At least one dielectric layer is selectively printed on at least a portion of the package to create a plurality of second recesses corresponding to a target circuit geometry. A conductive material is printed in at least a portion of the second recesses to create a circuit geometry. The circuit geometry includes a plurality of exposed terminals electrically coupled to the electric terminals on the semiconductor device.
Abstract: An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer to create an array of conductive paths. The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection between the distal portions and the first circuit member solely by compressive engagement.