Patents Assigned to Hua Wei Semiconductor (Shanghai) Co., Ltd.
  • Image sensor having large micro-lenses at the peripheral regions
    Patent number: 6638786
    Abstract: An image sensor includes an array of pixels formed in a semiconductor substrate. The pixels are grouped as a center portion of pixels and an outer portion of pixels. A first set of micro-lenses is formed over each of the pixels in the center portion of pixels. A second set of micro-lenses is formed over each of the pixels in the outer portion of pixels. The second set of micro-lenses differ from said first set of micro-lenses. In one embodiment, the second set of micro-lenses are taller than the first set of micro-lenses.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: October 28, 2003
    Assignee: Hua Wei Semiconductor (Shanghai ) Co., Ltd.
    Inventor: Katsumi Yamamoto
  • Dummy pattern for improving micro-lens formation in an image sensor
    Patent number: 6608358
    Abstract: An image sensor die formed on a wafer is disclosed. The image sensor die comprises a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element. Further, a dummy pattern is formed on the image sensor die, wherein the dummy pattern comprises ridges of a dummy pattern material that is operative to evenly distribute a micro-lens material over said wafer.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: August 19, 2003
    Assignee: Hua Wei Semiconductor (Shanghai) Co., Ltd.
    Inventor: Katsumi Yamamoto