Patents Assigned to Huazhong University of Science and Technology
  • Publication number: 20250140623
    Abstract: A high-temperature wide-bandgap power module and a preparation method thereof is provided in the present application. In the high-temperature wide-bandgap power module, SiC power chips are arranged in the cavity, and bonding wires are used to establish electrical connections. An ultrathin composite conformal coating consists of inorganic film and Parylene-HT film is arranged on the surface of the circuit to provide long-term reliable insulation while only imposing minor thermo-mechanical stresses on bonding joint at high-temperatures, which prolongs the module's life time. In addition, the hermetic sealing adopted in the present application blocks the external water, oxygen and chemical pollution, thereby alleviating the thermal degradation of the conformal coating and safeguards the internal circuit. Overall, the hermetic sealing and conformal coating ensure the long-term 250 degrees high-temperature working capability of the wide-bandgap power module.
    Type: Application
    Filed: December 27, 2023
    Publication date: May 1, 2025
    Applicant: Huazhong University of Science and Technology
    Inventors: Zhiqiang WANG, Yunchan WU, Rong ZHANG, Guoqing XIN, Xiaojie SHI
  • Patent number: 12276605
    Abstract: The present disclosure provides a detection and analysis method for rapid delineation of aging stages of styrene-butadiene-styrene (SBS) modified asphalt, including the following steps: performing a Fourier transform infrared spectroscopy (FTIR) test on unaged SBS-modified asphalt samples to obtain a copolymer index of IB0/S0 and neat asphalt functional group indexes, including the SI0, IB, aI0, ARI0, and CI0; performing the FTIR test on the aged SBS-modified asphalt samples to obtain an actual index of IB/S, SI, IB, aI, ARI, and CI; and delineating three aging stages of SBS-modified asphalt, including a polymer swelling stage, a polymer degradation stage and a component imbalance stage according to changes of functional group indexes. According to the present disclosure, the actual aging stages of the SBS-modified asphalt can be determined rapidly and accurately, providing a reasonable basis for the decision on pavement maintenance timing and mode.
    Type: Grant
    Filed: October 28, 2024
    Date of Patent: April 15, 2025
    Assignee: Huazhong University of Science and Technology
    Inventors: Derun Zhang, Peixin Xu, Ziyang Liu, Dongxing Luan, Zheng Liu, Yichen Guo, Pei Yu, Jinbiao Tang, Qisheng Hu, Chenhui Peng
  • Patent number: 12257614
    Abstract: The present invention belongs to the field of energy and environmental protection and particularly relates to an organic solid waste treatment device based on chemical-looping hydrogen production and a method for using the same. The device comprises a pyrolysis reactor and a sleeve-type chemical-looping reactor, the sleeve-type chemical-looping reactor comprises an inner cavity, an outer cavity annularly wrapping the inner cavity, a syngas output device, a hydrogen output device, a pyrolysis gas inlet device, and a water vapor inlet device, and the pyrolysis reactor can generate pyrolysis gas, which then is conveyed to the sleeve-type chemical-looping reactor through the pyrolysis gas inlet device.
    Type: Grant
    Filed: April 25, 2021
    Date of Patent: March 25, 2025
    Assignee: Huazhong University of Science and Technology
    Inventors: Xun Wang, Tingting Xu, Bo Xiao
  • Patent number: 12239503
    Abstract: A magnetic-field-adjustable micromagnetic orthodontic accelerator includes a cheek side plate, a tongue side plate and a supporting plate to form a structure of teeth sleeves, cheek side magnets and tongue side magnets are arranged on the cheek side plate and the tongue side plate respectively, the cheek side magnets and the tongue side magnets form a micro magnetic field environment around roots of to-be-moved teeth receiving orthodontic treatment, physiological magnetic field loss caused by traction of the orthodontic accessory is effectively compensated, metabolism and reconstruction of periodontal tissue of the to-be-moved teeth are promoted, and the orthodontic teeth moving process is accelerated.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: March 4, 2025
    Assignees: Union Hospital, Tongji Medical College, Huazhong University of Science and Technology
    Inventors: LiLi Chen, JiWei Sun, QingMing Tang, JunYuan Zhang
  • Patent number: 12197330
    Abstract: The present disclosure provides a data storage system, including data cache module, data processing module, and a persistent memory. The data cache module includes an on-chip mapping data cache and an on-chip counter cache, where the mapping data cache is configured to cache mapping data, and when the free space of the mapping data cache is less than a preset threshold, the least recently used mapping data cache line will be evicted from the cache and written back to the persistent memory. The data processing module encrypts/decrypts persistent memory data by using their counters, and accesses the persistent memory blocks indicated by their corresponding mapping data. The persistent memory comprises the first and second storage regions for the latest checkpoint data and modified working data in the current checkpoint interval respectively.
    Type: Grant
    Filed: September 19, 2023
    Date of Patent: January 14, 2025
    Assignees: ZHEJIANG LAB, Huazhong University of Science and Technology
    Inventors: Zhan Zhang, Yu Zhang, Jin Zhao, Haifei Wu
  • Patent number: 12189950
    Abstract: The present invention relates to a dynamic memory management apparatus and method for HLS, the apparatus has several searching and caching modules and several modifying and writing-back modules, the searching and caching modules are in connection with a DRAM storing module and a BRAM buffer, respectively, and the modifying and writing-back modules are in connection with the DRAM storing module and the BRAM buffer, respectively, the BRAM buffer is for caching information about nodes on a search path and registering information about modification made to the nodes. To remedy the defect that the traditional operating system is directly transplanted to the FPGA and has low execution efficiency, the present invention utilizes the advantage of the large capacity of the DRAM on the FPGA to realize efficient dynamic memory allocation and deallocation, and improve the usability and code reusability of HLS.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: January 7, 2025
    Assignees: Huazhong University Of Science And Technology, Zhejiang Lab
    Inventors: Long Zheng, Qinggang Wang, Xiaofei Liao, Zhaozeng An, Hai Jin
  • Patent number: 12178022
    Abstract: The present disclosure relates to the technical field of heat dissipation for electronic devices, and discloses a manifold microchannel heat sink based on directional optimization of hotspot areas, including a power module, a heat dissipation substrate, a cold source device, and a diverter manifold; the heat dissipation substrate is arranged on the power module, a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module. According to the manifold microchannel heat sink based on the directional optimization of hotspot areas, the local heat dissipation performance of the power module may be preliminarily changed by optimizing the microchannel on the heat dissipation substrate, which avoids poor heat dissipation temperature uniformity in a multi-heat source system.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: December 24, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Zhiqiang Wang, Yu Liao, Guoqing Xin, Xiaojie Shi, Yong Kang
  • Patent number: 12124433
    Abstract: The present invention relates to an implementation method for graphic-blockchain-orientated hybrid consensus, at least comprising: calling at least one module to generate a new data block and broadcast it; calling at least one module to check and validate the received new block based on predetermined rules; calling at least one module to generate a void block; and calling at least one module to update a committee member list. The existing graphic blockchain can only achieve probabilistic consensus, yet the present invention achieves deterministic consensus on graphic blockchain for the first time, thereby reaching consensus faster. The present invention decouples generation and consensus of blocks for the first time, so that the two parts can be designed separately in a modularized manner. The present invention provides the first totally decentralized hybrid consensus algorithm in the graphic blockchain. This is unachievable to many existing graphic blockchain such as IOTA and Obyte.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: October 22, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Jiang Xiao, Shuohua Dong, Jingtao Yue, Xiaohai Dai, Jian Chang, Shijie Zhang, Hai Jin
  • Patent number: 12117648
    Abstract: A hybrid integration method includes: assembling a motherboard chip, assembling a daughterboard chip, and assembling an integrated chip. The motherboard chip includes a motherboard chip body, a first metal region, a first vertical support assembly, and a first waveguide region arranged on the motherboard chip body, and the first waveguide region includes a first conventional waveguide region and a first coupling waveguide region used for vertical coupling which are fixedly connected to each other; the daughterboard chip includes a daughterboard chip body, a second metal region, a second vertical support assembly and a second waveguide region arranged on the daughterboard chip body, and the second waveguide region includes a second conventional waveguide region and a second coupling waveguide region used for vertical coupling which are fixedly connected to each other.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: October 15, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Weihua Guo, Xiangyang Dai, Qiaoyin Lu
  • Patent number: 12112110
    Abstract: The present invention belongs to the technical field of simulation of power semiconductor modules, and discloses a multi-physics co-simulation method of a power semiconductor module. The multi-physics co-simulation method of the power semiconductor module comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. The simulation time is greatly shortened, and the simulation efficiency is improved.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: October 8, 2024
    Assignees: Huazhong University of Science and Technology, Shenzhen Union Semiconductor Co., LTD
    Inventors: Zhiqiang Wang, Yayong Yang, Yuxin Ge, Guoqing Xin, Xiaojie Shi
  • Patent number: 12113699
    Abstract: The present invention relates to a network transmission optimization device for a graph-type blockchain, at least comprising a transaction processing module, a node managing module, and a route managing module, wherein the transaction processing module performs compression on a transaction, and transaction data obtained through the compression are transmitted among different clusters through a routing node selected by the route managing module from at least one cluster, wherein the at least one cluster is obtained through dividing plural nodes by the node managing module. The network transmission optimization method provides a transaction coding scheme to the existing graph-type blockchain systems, and improve use efficiency of network bandwidth by means of parallelized broadcast. The structured network topology of the network transmission optimization method is made to address delay among nodes, and is adaptive to dynamic joining and exit of nodes, thereby improving network transmission efficiency.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: October 8, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Jiang Xiao, Bingru Si, Jiajie Zeng, Shijie Zhang, Hanhua Chen, Hai Jin
  • Patent number: 12111348
    Abstract: An evaluation module configured to evaluate the lifespan of a multichip module, the multichip module comprising a first substrate and multiple chips under evaluation, includes a second substrate, configured to be the same as the first substrate, and having attachment positions corresponding to the attachment positions on the first substrate, and at least one evaluation chip, configured to be the same as the multiple chips under evaluation. The number of evaluation chips is less than the number of chips under evaluation by at least one. The at least one evaluation chip is arranged at an attachment position on the second substrate, such that the at least one evaluation chip and the chip under evaluation arranged at the corresponding attachment position on the multichip module have the same cooling performance and sustain the same thermal stress. The present disclosure also discloses a method for evaluating the lifespan of a multichip module.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: October 8, 2024
    Assignees: Robert Bosch GmbH, Huazhong University of Science and Technology
    Inventors: Lin Liang, Lubin Han, Yong Kang, Xudan Liu, Maojun He
  • Patent number: 12106024
    Abstract: Provided in the present invention are a geologically constrained infrared imaging detection method and system for an urban deeply-buried strip-like passage, pertaining to the crossing fields of geophysics and remote sensing technology.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: October 1, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Tianxu Zhang, Yongjun Jia, Yuehuan Wang, Xiuchang Gu, Wenbing Deng, Kechao Wang, Xin Liu
  • Publication number: 20240284644
    Abstract: The present disclosure relates to the technical field of heat dissipation for electronic devices, and discloses a manifold microchannel heat sink based on directional optimization of hotspot areas, including a power module, a heat dissipation substrate, a cold source device, and a diverter manifold; the heat dissipation substrate is arranged on the power module, a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module. According to the manifold microchannel heat sink based on the directional optimization of hotspot areas, the local heat dissipation performance of the power module may be preliminarily changed by optimizing the microchannel on the heat dissipation substrate, which avoids poor heat dissipation temperature uniformity in a multi-heat source system.
    Type: Application
    Filed: March 27, 2023
    Publication date: August 22, 2024
    Applicant: Huazhong University of Science and Technology
    Inventors: Zhiqiang WANG, Yu LIAO, Guoqing XIN, Xiaojie SHI, Yong KANG
  • Patent number: 12027952
    Abstract: The present disclosure provides a superconducting power generation device and a power generation method. The device includes a superconductor, a conductive coil, a permanent magnet and a cooling medium. When ambient temperature is lower than its superconducting critical temperature, the superconductor, made of the second-type superconducting material, is capable of generating a magnetic levitation force to an outer permanent magnet and levitate it. When an external force is applied to the permanent magnet, its position changes compared to the conductive coil, which affects the magnetic flux passing through the coil and induces the generation of electromotive force in the coil, thereby converting mechanical energy to electric energy.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: July 2, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Bin Su, Zheng Ma, Chunze Yan, Yusheng Shi
  • Patent number: 12026260
    Abstract: The present invention relates a device for improving robustness of deep-learning based detection of source-code vulnerability, the device at least comprises a code-converting module, a mapping module, and a neural-network module, wherein the mapping module is in data connection with the code-converting module, the mapping module is in data connection with the neural-network module, respectively, and the neural-network module includes at least two first classifiers, based on a received first training program source code, the mapping module maps a plurality of code snippets, and the neural-network module trains the at least two first classifiers according to a first sample vector. The present invention improves the robustness of detection of source-code vulnerability by performing classification training on the feature generators and the classifiers.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: July 2, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Deqing Zou, Jing Tang, Zhen Li, Hai Jin
  • Patent number: 11999082
    Abstract: The present invention provides a fast-curing molding process for epoxy resin. The method includes the following steps: S1, mixing epoxy resin A glue and a protein-grafted manganese-zinc-iron oxide nanomaterial well into a colloidal state, and grounding the mixture for 10 to 30 min; S2, adding epoxy resin B glue to the mixed colloid in S1, and performing ultrasonic dispersion at 20 to 30° C. for 10 to 30 min; and S3, placing the mixture obtained after ultrasonic dispersion in S2 in a vacuum environment for 20 to 40 min, then taking the mixture out and injecting the mixture into a mold, placing the mold and the mixed colloid into an electromagnetic induction heater, placing the electromagnetic induction heater in a magnetic field environment with a magnetic field intensity of 1 to 1.5 mT for 2 to 3 h, cooling and then taking them out to obtain the cured epoxy resin.
    Type: Grant
    Filed: October 26, 2023
    Date of Patent: June 4, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Renfu Li, Yichao Li, Ao Sun, Jiaji Sun
  • Publication number: 20240149500
    Abstract: The present invention provides a fast-curing molding process for epoxy resin. The method includes the following steps: S1, mixing epoxy resin A glue and a protein-grafted manganese-zinc-iron oxide nanomaterial well into a colloidal state, and grounding the mixture for 10 to 30 min; S2, adding epoxy resin B glue to the mixed colloid in S1, and performing ultrasonic dispersion at 20 to 30° C. for 10 to 30 min; and S3, placing the mixture obtained after ultrasonic dispersion in S2 in a vacuum environment for 20 to 40 min, then taking the mixture out and injecting the mixture into a mold, placing the mold and the mixed colloid into an electromagnetic induction heater, placing the electromagnetic induction heater in a magnetic field environment with a magnetic field intensity of 1 to 1.5 mT for 2 to 3 h, cooling and then taking them out to obtain the cured epoxy resin.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 9, 2024
    Applicant: Huazhong University of Science and Technology
    Inventors: Renfu LI, Yichao LI, Ao SUN, Jiaji SUN
  • Patent number: 11976984
    Abstract: The present disclosure belongs to the technical field of power electronic converters, and discloses a method and a system for predicting a junction temperature of a power semiconductor module in the full life cycle and a terminal. The method includes the steps: arranging an NTC thermistor network to monitor the temperature of each area inside the power module when the power module works; obtaining data for training the neural network by utilizing finite element simulation or experiments, and building a neural network model among the temperature of the NTC resistor network, a water flow rate, an aging factor and the junction temperature of the chip under working conditions. The present disclosure improves the junction temperature prediction accuracy of areas with relatively large errors comprehensively and realizes the high-precision junction temperature prediction under all working conditions.
    Type: Grant
    Filed: March 12, 2023
    Date of Patent: May 7, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Zhiqiang Wang, Yayong Yang, Guoqing Xin, Xiaojie Shi, Yong Kang
  • Patent number: 11977819
    Abstract: The present disclosure discloses a design method of a soil cover layer of a solid waste landfill considering the effect of plant root, which relates to the field of designing a soil cover for a solid waste landfill and aims to solve the problem of the prior art that does not consider the non-linear spatial variation of water content and the effect of plant root on the gas migration process. By comprehensively considering the type of plant root architecture, the distribution of water content varying with space, the errors of calculating gas migration caused by assuming that the water content of the cover layer is constant and ignoring the effect of plant root is effectively reduced; and the actual environment of the on-site cover layer is more comprehensively considered, thus improving the calculation accuracy.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: May 7, 2024
    Assignee: Huazhong University of Science and Technology
    Inventors: Hefu Pu, Ming Min, Yu Miao, Junjie Zheng, Xiaojun Wen