Patents Assigned to Hub Labels, Inc.
  • Patent number: 7393573
    Abstract: A direct mail form having a bond paper layer extending across an entire width and length of the form. An adhesive label portion extends across a limited portion of the bond paper layer. The adhesive label portion of the bond paper layer is treated with a silicone release coating prior to application of the adhesive label portion to the bond paper layer. A bottom surface of the bond paper layer is printed prior to application of the silicone layer. The adhesive label portion and remaining free portion of the bond paper layer are subsequently printed with the bond paper layer also being printed prior to application of the silicone layer and adhesive layer portion so that upon removal of the adhesive label portion, printing is exposed.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: July 1, 2008
    Assignee: Hub Labels, Inc.
    Inventors: Anton T. Dahbura, John Flannery