Abstract: A thermoplastic compound useful in filling pores and voids in wooden materials, particularly edge regions, wherein the thermoplastic compound comprises a blend of two copolyesters and optionally fillers, wherein the first copolyester has a melting point of 140° C. to 260° C. and a glass transition temperature of −10° C. to 80° C., and wherein the second copolyester has a melting point of 120° C. to 190° C. and a glass transition temperature of −70° C. to 10° C. Also, a method of filling pores in a wooden material comprising using a thermoplastic compound having a softening point of 140° C. to 200° C., an open time of 2 to 15 seconds, and a viscosity number of 30 to 150 ml/g, with the thermoplastic compound preferably being a blend of two different copolyesters, wherein the application of such thermoplastic compounds enable the surfaces of chipboard panels and the like to be smoothed in a continuous one-pass process.