Patents Assigned to HUNETPLUS CO., LTD.
  • Publication number: 20260319359
    Abstract: A multilayer molecular film photoresist is provided. The multilayer molecular film photoresist comprises a plurality of molecular lines extending upward from a substrate and arranged laterally. Each molecular line comprises linearly connected monomers represented by the following Chemical Formula 1: In Chemical formula 1, one of the *s is a bond to a functional group in a lower monomer, and the other is a bond to a functional group in an upper monomer; OM is an organic monomer; MM is a main inorganic monomer comprising a main metal atom; m is 1 to 2, n is 1 to 2, and l is 1 to 1000. A side inorganic monomer including a metal atom is positioned between the molecular lines and bonded to a side of the organic monomer (OM) in one of the molecular lines. A crosslinking functional group is bonded to a side of the organic monomer (OM) in another of the molecular lines.
    Type: Application
    Filed: February 8, 2024
    Publication date: October 15, 2026
    Applicant: HUNETPLUS CO., LTD.
    Inventors: Myung Mo SUNG, Yeong Eun BAK, Hyeon Seok JI, Jae Hyuk LEE, Jinho AHN
  • Patent number: 9246050
    Abstract: Provided is a method of manufacturing a substrate for a light emitting diode including a convex section forming step and a crystallization/crystallizing step. According to the method and the substrate for the light emitting diode, light extraction is significantly improved and nano to micron sized pattern, economically formed.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: January 26, 2016
    Assignee: HUNETPLUS CO., LTD.
    Inventors: Hyuk-Jin Cha, Heon Lee, Eun-Seo Choi