Abstract: A method for repairing photomask pattern defects includes patterning a target layer on a transparent substrate, thereby forming first patterns, detecting a defect die including a defect pattern by inspecting the first patterns; forming a mask layer on the transparent substrate, forming a mask pattern that selectively exposes the defect die by performing an exposure process and a development process on the mask layer; etching the target layer of the exposed defect die using the mask pattern as an etching mask to expose the transparent substrate, depositing a target layer on the exposed defect die of the transparent substrate, and patterning the deposited target layer, thereby forming a second pattern on the defect die.