Patents Assigned to Huntsman Advanced Materials Americas, Inc.
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Publication number: 20080157436Abstract: A process for forming a three-dimensional article in sequential layers in accordance with a digital model of the article. The process comprises the steps of defining a layer of powder material, applying a liquid reagent to the powder layer in a pattern corresponding to the digital model, and repeating these steps to form successive layers. The powder comprises a first reactive component and the liquid includes a second active component capable of reacting with the first reactive component so that the article is built up in layers.Type: ApplicationFiled: March 7, 2008Publication date: July 3, 2008Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Ranjana Patel, Richard J. Peace, Yong Zhao, Jeremy Powell, Michael Rhodes
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Patent number: 7387812Abstract: The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.Type: GrantFiled: November 21, 2002Date of Patent: June 17, 2008Assignee: Huntsman Advanced Materials Americas Inc.Inventors: Roger Pierre-Elie Salvin, Martin Roth, Masato Hoshino, Yasuharu Nojima
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Patent number: 7378228Abstract: A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.Type: GrantFiled: June 21, 2006Date of Patent: May 27, 2008Assignee: Huntsman Advanced Materials Americas Inc.Inventors: Yasuaki Sugano, Yasuharu Nojima
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Publication number: 20070292620Abstract: Special amine compositions comprising a) 30-70% by weight of a polyetherdiamine of the general formula (I) in which n is from 10 to 70, b) 3-30% by weight of a monoamine of the general formula R1—NH2, in which R1 is the straight-chain or branched, saturated or preferably unsaturated radical of a hydrocarbon having 5 to 22 carbon atoms or of a monofunctional polyetheramine having a molecular weight of up to 400 g/mol and c) 3-30% by weight of a di- or triamine and d) 5-40% by weight of an alkylphenol of the general formula (II) in which R2 is the straight-chain, branched or cyclic, saturated or unsaturated radical of a hydrocarbon having 5 to 14 carbon atoms, and curable epoxy resin compositions comprising these special amine compositions, the use of which results in thermosets which have a low degree of crosslinking, are resilient even at low temperatures and are resistant to chemical compositions, and the production of shaped articles and coatings using these curable compositions.Type: ApplicationFiled: July 8, 2005Publication date: December 20, 2007Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Jorg Volle, Michael Vogel
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Patent number: 7307123Abstract: A photocurable composition, including (a) a photocurable monomer, e.g. a cationically curable monomer and/or a radically curable monomer; (b) reactive particles comprising a crosslinked elastomeric core, e.g. made of polysiloxane material, and a shell of reactive groups on an outer surface of the core, wherein the reactive groups comprise epoxy groups, ethylenically unsaturated groups, or hydroxy groups; and (c) an appropriate photoinitiator, e.g. a radical photoinitiator; and a cationic photoinitiator. A method of making a 3-D object from such a composition and a 3-D object made by the method are also provided. The cured composition generally has a smooth surface. The use of the reactive particles makes the composition more stable and the particles do not readily separate out.Type: GrantFiled: April 18, 2003Date of Patent: December 11, 2007Assignee: Huntsman Advanced Materials Americas Inc.Inventors: David Johnson, John Wai Fong
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Publication number: 20070256781Abstract: A photocurable composition comprising cationically curable compound, an acrylate-containing compound; a hydroxyl-containing compound; a cationic photoinitiator; and a free radical photoinitiator; wherein said composition has less than 0.54 equivalents of cationically curable groups, less than 0.10 equivalents of acrylate groups and less than 0.10 equivalents of hydroxyl 0 groups per 100 grams of said composition.Type: ApplicationFiled: April 11, 2007Publication date: November 8, 2007Applicant: Huntsman Advanced Materials Americas Inc.Inventors: David Johnson, Frank Tran, John Fong, Richard Leyden, Ranjana Patel
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Publication number: 20070184281Abstract: Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 1O° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.Type: ApplicationFiled: April 5, 2007Publication date: August 9, 2007Applicant: Huntsman Advanced Materials Americas Inc.Inventor: Frans Setiabudi
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Patent number: 7232850Abstract: A photocurable composition comprising cationically curable compound, an acrylate-containing compound; a hydroxyl-containing compound; a cationic photoinitiator; and a free radical photoinitiator; wherein said composition has less than 0.54 equivalents of cationically curable groups, less than 0.10 equivalents of acrylate groups and less than 0.10 equivalents of hydroxyl groups per 100 grams of said composition.Type: GrantFiled: October 3, 2003Date of Patent: June 19, 2007Assignee: Huntsman Advanced Materials Americas Inc.Inventors: David Johnson, Frank Tran, John Fong, Richard Leyden, Ranjana Patel
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Publication number: 20070135601Abstract: The present invention relates to complexes of organoboranes with amino functional organosilicon compounds which are effective polymerisation initiators for radically polymerisable systems, especially acrylate or methacrylate adhesives. The complexes are partcularly useful in the preparation of adhesives for bonding low surface energy plastics based on, for example, polyolefins and polyfluoroolefins.Type: ApplicationFiled: November 10, 2004Publication date: June 14, 2007Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Constantinos Diakoumakos, Dimiter Kotzev
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Publication number: 20070135588Abstract: A fast curable non-isocyanate-based polyurethane- and polyurethane-epoxy network nanocomposite polymeric compositions are derived upon crosslinking a mixture comprising of natural or modified nano-clay [ionic phyllosilicate] with platelet thickness in the scale of A (˜1 nm) and aspect ratio (length/thickness) higher than 10 (nm)] preferably natural or modified montmorillonite with either a monomer(s) or oligomer(s) bearing at least one cyclocarbonate group or a mixture of the latter with an epoxy resin, with a hardener, which is a monomer or oligomer or mixtures therefrom, bearing primary and/or secondary amino groups. The use of the nanoclays reduces the gel time and increases the adhesion of the cured polyurethane and polyurethane/epoxy hybrid and also reduces its water absorption.Type: ApplicationFiled: August 13, 2004Publication date: June 14, 2007Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Constantinos Diakoumakos, Dimiter Kotzev
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Patent number: 7223820Abstract: Compounds of formula Ia or Ib wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5, E is an (m+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and m is an integer from 0 to 3, X is —O—, —C(?O)O or —CHR4—, with R4 and R3 together forming an ethylene group, R1 and R2 are, each independently of the other, hydrogen or methyl, R3 is hydrogen, or R3 and R4 together form an ethylene group, and R5 is a monovalent aliphatic, cycloaliphatic, araliphatic or aromatic radical, are highly reactive curing agents for epoxy resins and yield cured products having improved resistance to chemicals.Type: GrantFiled: March 31, 2004Date of Patent: May 29, 2007Assignee: Huntsman Advanced Materials Americas, Inc.Inventors: Walter Fischer, Claudio A Gabutti, Isabelle Frischinger, Rolf Wiesendanger
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Patent number: 7217771Abstract: Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min); (d) a photopolymerizable compound; and (e) a photoinitiator; the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.Type: GrantFiled: July 29, 2002Date of Patent: May 15, 2007Assignee: Huntsman Advanced Materials Americas Inc.Inventor: Frans Setiabudi
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Patent number: 7202286Abstract: The present invention relates to UV-curable compositions, the process for preparing the compositions and to the use of the curable compositions. The compositions contain: a) at least one oxetane compound; b) at least one polyfunctional cycloaliphatic epoxy compound; c) at least one multifunctional hydroxy compound; and d) at least one curing agent.Type: GrantFiled: February 8, 2005Date of Patent: April 10, 2007Assignee: Huntsman Advanced Materials Americas Inc.Inventor: Kevin B Hatton
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Publication number: 20070043153Abstract: The invention relates to adhesion promoters for plastisols based on polyaminoamides, characterized in that the adhesion promoter comprises not only a polyaminoamide but also at least 10% by weight, and at most 60% by weight, based on the total amount of adhesion promoter, of ethyldiglycol (ethyl Carbitol), and to a process for the production of coatings and adhesive bonds for materials, and also to plastisols in which these adhesion promoters are used concomitantly.Type: ApplicationFiled: July 8, 2004Publication date: February 22, 2007Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Alfred Kruse, Christa Broll, Jorg Volle
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Patent number: 7141629Abstract: A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, exhibits high storage stability and is useful as protective coating or adhesive.Type: GrantFiled: January 23, 2001Date of Patent: November 28, 2006Assignee: Huntsman Advanced Materials Americas Inc.Inventors: Sim Chow, Dean Anthony Bugg
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Publication number: 20060247333Abstract: A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, exhibits high storage stability and is useful as protective coating or adhesive.Type: ApplicationFiled: June 27, 2006Publication date: November 2, 2006Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Sim Chow, Dean Bugg
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Publication number: 20060241251Abstract: A coherent insert, in particular for filling a three-dimensional cavity, especially a cavity in the core of a sandwich-type composite, which insert is solid at ambient temperature, characterized in that the insert consists of a solid curable composition, which expands and is able to adhesively bond when heat-cured.Type: ApplicationFiled: June 21, 2006Publication date: October 26, 2006Applicant: Huntsman Advanced Material Americas Inc.Inventor: Dean Bugg
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Publication number: 20060240356Abstract: A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.Type: ApplicationFiled: June 21, 2006Publication date: October 26, 2006Applicant: Huntsman Advanced Materials Americas Inc.Inventors: Yasuaki Sugano, Yasuharu Nojima
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Publication number: 20060211845Abstract: Compounds of the general formulae (I) and (II): where R1, R2 and R3 each independently of one another are H; C1-17alkyl; C3-12cycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyl groups; C6-10, aryl, optionally substituted by 1-3 C1-4alkyl groups, —CN, Hal, OH, or C1-10alkoxy; C7-15phenylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-12alkenyl; C3-12alkynyl; or aromatic or aliphatic C3-12acyl; R4, R5, R6, R7, R8, and R9 each independently of one another are H; C1-17alkyl, C3-12Ccycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyl groups; C6-10aryl, optionally substituted by 1-3 C1-4alkyl groups; C7-15phenylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-17alkenyl; C3-12alkynyl; C1-12alkoxy; or OH; for formula (1) R is C1-12alkyl; C3-12cycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkylalkyl; optionally substituted by C1-4alkyl groups; C6-10aryl, oType: ApplicationFiled: April 13, 2004Publication date: September 21, 2006Applicant: Huntsman Advanced Materials Americas Inc.Inventor: Ulrich Weidmann
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Publication number: 20060204895Abstract: Linear crosslinkable polyurethanes obtained from (a) at least one diisocyanate having 2 to 30 carbon atoms, (b) at least one aliphatic or cycloaliphatic diol having 2 to 30 carbon atoms, to whose carbon chain at least one carboxyl group is covalently bonded, and some or all of said carboxyl groups have been esterified with an olefinically unsaturated C3-C8alcohol or with the glycidyl ester of an olefinically unsaturated C3-C8carboxylic acid, and (c) optionally at least one aliphatic or cycloaliphatic diol having 2 to 30 carbon atoms, to whose carbon chain at least one carboxyl group is covalently bonded. The polyurethanes are suitable, alone or as a mixture with other reactive components, for thermal and/or photochemical crosslinking in crosslinkable compositions for the production of mouldings, coatings and in particular solder masks.Type: ApplicationFiled: August 4, 2004Publication date: September 14, 2006Applicant: Huntsman Advanced Materials America Inc.Inventors: Bernhard Sailer, Catherine Schoenenberger, Ottilie Zelenko